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Author

Ian Hu

Observed name: Hu Ian
ORCID: 0000-0002-8502-2342
Observed ORCID: 0000-0002-8502-2342
OpenAlex ID: A5035332310
A Comparative Study of 2.5D and Fan-out Chip on Substrate : Chip First and Chip Last
2020 · Wei-Hong Lai, Penny Yang, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 45
Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
2017 · Ying-Chih Lee, Wei-Hong Lai, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 36
Warpage Characterization of Glass Interposer Package Development
2017 · Meng-Kai Shih, Charles Hsu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 16
Synergetic effects of wafer rigidity and retaining-ring parameters on contact stress uniformity in chemical mechanical planarization
2011 · Ian Hu, Tian-Shiang Yang, et al. · The International Journal of Advanced Manufacturing Technology · 12
Material and Structure Design Optimization for Panel-Level Fan-Out Packaging
2019 · Dao-Long Chen, Ian Hu, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 9
Performance and reliability of TIM in high power HFCBGA
2015 · Ian Hu, MengKai Shih, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 8
High Power Large Size HFCBGA Thermal Characterization
2019 · Ian Hu, Jung-Che Tsai, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
Strip warpage assessment of dual side molding SiP module
2017 · Ming-Han Wang, Ian Hu, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
High Thermal Performance Package with Anisotropic Thermal Conductive Material
2017 · Ian Hu, Jia-Rung Ho, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 7
Design for Void Free Transfer Molding SiP
2020 · Bing-Yuan Huang, Ian Hu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6
Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages
2018 · Meng-Kai Shih, Eddie Tsai, et al. · 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) · 6
Deformation prediction of 2.5D IC package
2016 · Ian Hu, Ming-Han Wang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6
Effect of Effective Curing Shrinkage of EMC on Strip Warpage During IC Encapsulation Process
2024 · Ian Hu, Yi-Rong Huang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process
2021 · Bo-Heng Chen, Sheng-Jye Hwang, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
High-Efficiency Extraction Method for Thermal Network Model of Advanced Electronic Packages
2025 · Ian Hu, Yu-Chih Kuo, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 4
Void Formation Analysis in the Molded Underfill Process for Flip-Chip Packaging
2025 · Ian Hu, Tzu-Chun Hung, et al. · Computers, materials & continua/Computers, materials & continua (Print) · 4
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System Thermal Analysis of RF SiP Module in Smartphone
2020 · Cheng-Yu Tsai, H.E. Chen, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 4
Transient Thermal Resistance Analysis for IC Packages
2019 · Hsin-En Chen, Penny Yang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Strength characterization of ultrathin chips by using large deflection theory of multi-layer plate for three-point bending tests
2024 · Dao-Long Chen, Chien-Ming Chen, et al. · Extreme Mechanics Letters · 3
Compression Molding Mechanism and Parameter Evaluation of SiP
2020 · YiXuan Lin, Ian Hu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 3
Substrate Shrinkage Effect on Warpage Evaluation for High Bandwidth Package on Package
2018 · Ming-Han Wang, Ian Hu, et al. · IEEE CPMT Symposium Japan (ICSJ) · 3
Investigation of design and material optimization on high bandwidth Package on Package
2017 · Ian Hu, Wei-Hong Lai, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
A novel mixture rule for multi-layer plates with thermal bending and twisting effects applied to FOCoS devices
2024 · Dao-Long Chen, Chien-Ming Chen, et al. · Materials Science in Semiconductor Processing · 2
New / Old JEDEC board level drop reliability test standards evaluation: Measurement and simulation study
2017 · Ryan Chen, Ming-Han Wang, et al. · IEEE CPMT Symposium Japan (ICSJ) · 2
Dynamic stiffness analysis of repetitive control and applied to Advanced Metrology Analyzer
2016 · Wu-Sung Yao, Ian Hu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Works count: 39
Citation count: 215
H-index: 7
I10-index: 4
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