Work

Epoxy Molding Compound Filler Clogging Simulation During Integrated Circuit Encapsulation Process

Year: 2021

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2021.3129886

Authors: Bo-Heng Chen, Sheng-Jye Hwang, Yu-Yang Chang, Yu-Shuo Yang, Huei-Huang Lee, Bing-Yuan Huang, Ian Hu, Dao-Long Chen, David Tarng, C. P. Hung

Institutions: National Cheng Kung University, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3215027997

FWCI: 0.144

Cites: 22

Cited by: 5

Related to: 10