Work

High-Efficiency Extraction Method for Thermal Network Model of Advanced Electronic Packages

Year: 2025

Type: article

Source: IEEE Transactions on Components Packaging and Manufacturing Technology

DOI: 10.1109/tcpmt.2025.3547229

Authors: Ian Hu, Yu-Chih Kuo, Tian-Shiang Yang

Institutions: National Kaohsiung University of Science and Technology, National Cheng Kung University

Language: English

Topic: Heat Transfer and Numerical Methods

Subfield: Computational Mechanics

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

Funder: Ministry of Science and Technology, Taiwan

Award: The Integration of Artificial Intelligence Techniques and Numerical Simulation Methods on the Thermal and Mold Flow Effect of Electronics Packaging

OpenAlex ID: W4408100313

FWCI: 1.796

Cites: 30

Cited by: 4

Related to: 10