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Thomas Krebs
Observed name:
T. Krebs
Observed institutions:
CISSOID (Belgium),
Heraeus (Germany)
OpenAlex ID:
A5043177326
A breakthrough in power electronics reliability — New die attach and wire bonding materials
2013
·
Thomas Krebs
, Susanne Duch
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
28
Novel interconnect materials for high reliability power converters with operation temperatures above 150°C
2012
·
Susanne Duch
, Thomas Krebs
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
High temperature electronics for high power density DC-DC Converters and Motor Drives
2010
·
Pierre Delatte
, Vincent Dessard
, et al.
·
International Conference on Integrated Power Electronics Systems (CIPS)
·
8
Comparison of Thermal Measurement Methods of Die Attach Materials Used in Power Electronic Modules
2016
·
Wolfgang Schmitt
, Susanne Duch
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Adjust the mechanical properties of sintered silver layers using additives
2016
·
Wolfgang Schmitt
, Thomas Krebs
·
4
Sinter adhesive - new horizons in semiconductor packaging
2011
·
Yvonne Lower
, Thomas Krebs
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Statistical analysis of stencil technology for wafer-level bumping
2014
·
Robert W. Kay
, Gerard Cummins
, et al.
·
Soldering and Surface Mount Technology
·
1
Considerations for Sintering in High Temperature Electronics
2019
·
Thomas Krebs
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
PDF
Rate controlled sintering: A novel approach to improve quality and yield of die-attach interconnects
2019
·
Simon Merkert
, Aaron Hutzler
, et al.
·
IEEE International Workshop on Integrated Power Packaging (IWIPP)
Stencil technology for wafer level bumping
2012
·
Robert W. Kay
, Gerard Cummins
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
New High Temperature Electronic Components for Power Management and Motor Control Applications
2010
·
Pierre Delatte
, V. Dessard
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
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Works count:
11
Citation count:
56
H-index:
4
I10-index:
1
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