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Nur Syahirah Mohamad Zaimi

Observed names: N S M Zaimi, N. S. Mohamad Zaimi, N.S. Mohamad Zaimi, N.S.M. Zaimi, Nur Syahirah Muhammad Zaimi
ORCID: 0000-0002-8056-4505
Observed ORCID: 0000-0002-8056-4505
OpenAlex ID: A5044355284
Formation and Growth of Intermetallic Compounds in Lead-Free Solder Joints: A Review
2022 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 83
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Effect of kaolin geopolymer ceramic addition on the properties of Sn-3.0Ag-0.5Cu solder joint
2020 · N.S. Mohamad Zaimi, M.A.A. Mohd Salleh, et al. · Materials Today Communications · 21
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Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
2021 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 16
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Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste
2018 · N.S. Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 10
Microstructure refinement, thermal stability and mechanical properties improvements of Sn-3.0Ag-0.5Cu-xSb
2025 · N.S. Mohamad Zaimi, M.A.A. Mohd Salleh, et al. · Materials Characterization · 9
Liquid/Solid Interaction of Sn-58Bi/Sn-3.0Ag-0.5Cu Dissimilar Joints during Soldering at Low Temperature by In-Situ Synchrotron Imaging
2022 · M. I. I. Ramli, M. A. A. Mohd Salleh, et al. · JOM · 9
Influence of kaolin geopolymer ceramic additions to the wettability and electrical properties of Sn-3.0Ag-0.5Cu (SAC305) lead free solder
2019 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 6
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The Effect of Geopolymer Ceramic Additions to The Wettability and Shear strength of Sn-Ag-Cu (SAC) Solder: A Preliminary Study
2019 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 6
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Effect of Ga additions as micro-alloying element to microstructure formation, thermal properties and mechanical properties of Sn-0.7Cu solder alloy
2026 · Sufian Firdaus Nazri, Mohd Arif Anuar Mohd Salleh, et al. · Materialia · 5
Effect of indium on microstructure, phase stability, anisotropic lattice behavior and mechanical performance of Sn-58Bi solder alloy
2025 · M. H. Zan Hazizi, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 4
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Effect of indium on interfacial intermetallic compound (IMC) growth, thermal behaviour and mechanical properties of Sn–10Cu-xIn solder joints under multiple reflow cycles
2025 · Muhammad Fadlin Hazim Baser, Mohd Arif Anuar Mohd Salleh, et al. · Materials Chemistry and Physics · 4
A Short Review on the Influence of Antimony Addition to the Microstructure and Thermal Properties of Lead-Free Solder Alloy
2023 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Archives of Metallurgy and Materials · 4
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Effect of Kaolin Geopolymer Ceramics Addition on the Microstructure and Shear Strength of Sn-3.0Ag-0.5Cu Solder Joints during Multiple Reflow
2022 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 4
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Impact of Bismuth as Microalloying Element in Sn-0.7Cu Lead-Free Solder Alloys
2025 · N.S.M. Zaimi, M.A.A.M. Salleh, et al. · Archives of Metallurgy and Materials · 3
Influence of Fly Ash Geopolymer Ceramic Powder Addition on Sn-3.0Ag-0.5Cu Solder Joints
2022 · Flora Somidin, Nur Fatin Natasha Ilias, et al. · Journal of Physics Conference Series · 3
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Influence of Sintering Temperature on the Pore Structure of an Alkali-Activated Kaolin Based Geopolymer
2023 · M.I.I. Ramli, M.A.A.M. Salleh, et al. · Archives of Metallurgy and Materials · 2
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Microstructure Study of Mix Assembly Lead-free Sn-Ag-Cu Ball Grid Array and Sn-10Cu Solder Paste
2022 · Rita Mohd Said, Kalaiarasi A/P Sulwarajan, et al. · Journal of Physics Conference Series · 2
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Characterization of geopolymer ceramic reinforced Sn-0.7Cu composite solder: Effect of milling time and speed.
2019 · Marliza Mostapha, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 2
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Influence of Indium on Cu6(Sn,In)5 Formation and Microstructure Refinement in Sn-10wt.%Cu Solder Alloy
2026 · Muhammad Fadlin Hazim Baser, Mohd Arif Anuar Mohd Salleh, et al. · JOM · 1
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The Influence of Indium to the Microstructure and Solidification of Sn-58Bi Low Temp Lead-Free Solder
2025 · Muhammad Hafiz Zan Hazizi, Mohd Arif Anuar Mohd Salleh, et al. · Springer proceedings in physics · 1
The Microstructure Evolution and Activation Energy Study of Cu6Sn5 and Cu3Sn Intermetallic Compound Layer of Sn-10Cu/Cu Solder Joint
2024 · Muhammad Amirul Aiman A. Ramlee, Rita Mohd Said, et al. · International Journal of Nanoelectronics and Materials (IJNeaM) · 1
Effect of Al Addition to the Solidification and Microstructure Formation on Sn–Ag–Cu Solder Alloy
2023 · Mohd Izrul Izwan Ramli, Ain Najihah Saim, et al. · Springer proceedings in physics · 1
Synthesis of Kaolin Geopolymer as Ceramic Reinforcement in Lead-Free Solder
2022 · Nur Syahirah Mohamad Zaimi, Mohd Izrul Izwan Ramli, et al. · Journal of Physics Conference Series · 1
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Advanced Electronic Packaging Fundamentals, Materials and Processing
2026 · Mohd Arif Anuar Mohd Salleh, Dewi Suriyani Che Halin, et al.
Effect of Indium Addition on the Microstructure Formation and the Wettability of Sn10Cu Lead-Free Solder Alloys
2025 · Muhammad Fadlin Hazim Baser, Mohd Arif Anuar Mohd Salleh, et al. · Springer proceedings in physics
Works count: 31
Citation count: 198
H-index: 6
I10-index: 4
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