Work

Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste

Year: 2018

Type: article

Source: Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena

DOI: 10.4028/www.scientific.net/ssp.280.169

Authors: N.S. Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, A.M. Mustafa Al Bakri, Rita Mohd Said, Norainiza Saud

Institution: Universiti Malaysia Perlis

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2889176568

FWCI: 0.479

Cites: 22

Cited by: 10

Related to: 10