Get started
Author

Rita Mohd Said

Observed names: R M Said, R Mohd Said, R. M. Said, R. Mohd Said, R.M. Said, Rita MOHD SAID, Rita. Mohd Said
Observed institution: Universiti Malaysia Perlis
ORCID: 0000-0001-5149-4408
Observed ORCID: 0000-0001-5149-4408
OpenAlex ID: A5033488141
Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
2016 · M.I.I. Ramli, N. Saud, et al. · Microelectronics Reliability · 65
The Effect of Ni and Bi Additions on the Solderability of Sn-0.7Cu Solder Coatings
2019 · M. I. I. Ramli, M. A. A. Mohd Salleh, et al. · Journal of Electronic Materials · 35
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
2021 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 16
PDF
Transient liquid phase bonding for solder-a short review
2019 · Norainiza Saud, Rita Mohd Said · IOP Conference Series Materials Science and Engineering · 16
PDF
Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
2020 · R. Mohd Said, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 14
Influence of Bi Addition on Wettability and Mechanical Properties of Sn-0.7Cu Solder Alloy
2018 · Mohd Izrul Izwan Ramli, M.S.S. Yusof, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 14
Effect of surface finish on the wettability and electrical resistivity of Sn-3.0Ag-0.5Cu solder
2019 · Siti Farahnabilah Muhd Amli, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 10
PDF
Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste
2018 · N.S. Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 10
Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste
2016 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Key engineering materials · 10
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
2021 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 8
PDF
Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
2018 · Nurul Razliana Abdul Razak, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 8
Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder
2016 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Key engineering materials · 7
Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement
2015 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Applied Mechanics and Materials · 7
Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging
2018 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 6
Effect of TiO2 on the Formation of Primary and Interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering
2016 · Mohd Arif Anuar Mohd Salleh, R.M. Said, et al. · Key engineering materials · 6
Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder
2014 · Norhayanti Mohd Nasir, Norainiza Saud, et al. · Materials science forum · 6
Mixed Assembly of Lead-free Solder Joint: A Short Review
2022 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Journal of Physics Conference Series · 5
PDF
The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint
2021 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Metals · 5
PDF
The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy
2014 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Materials science forum · 5
Effect of indium on interfacial intermetallic compound (IMC) growth, thermal behaviour and mechanical properties of Sn–10Cu-xIn solder joints under multiple reflow cycles
2025 · Muhammad Fadlin Hazim Baser, Mohd Arif Anuar Mohd Salleh, et al. · Materials Chemistry and Physics · 4
Effect of Zn Additions on Thermal and Mechanical Properties of Sn-0.7Cu-xZn Solder Alloy
2018 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4
Microstructure Evolution of Sn-Cu Based Solder Paste with Different Cu Concentration Subjected to Multiple Reflows
2018 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 4
The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy
2015 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Materials science forum · 4
Effect of SiC Particles Addition on the Wettability and Intermetallic Compound Layer Formation of Sn-Cu-Ni (SN100C) Solder Paste
2015 · Rita Mohd Said, Norainiza Saud, et al. · Applied Mechanics and Materials · 4
Influence of recycled wastes on ferrosilicon production in steel making applications: A short review
2022 · Anis Nadhirah Ismail, Mohd Hakim Ibrahim, et al. · Journal of Physics Conference Series · 3
PDF
Works count: 57
Citation count: 312
H-index: 9
I10-index: 9
Year
Topic
Type