Year: 2019
Type: conference-paper
Abstract: The issues on the replacement of high Pb solder for high power module application has been a major concern among researchers since Pb could caused toxicity to the environment. Alternatively, transient liquid phase (TLP) has becomes a potential bonding technology for high power module devices. Typical TLP bonding for solder is a bonding method that using an interlayer of low and high temperature metal. However, a new transient liquid phase bonding which dealing with solder in the form of powder and paste has been developed. Both bonding methods have successfully increased the melting temperature of the bonded alloys higher than the bonding temperature as will be discussed further.
Authors: Norainiza Saud, Rita Mohd Said
Institution: Universiti Malaysia Perlis
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: diamond
OpenAlex ID: W2995963724