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Norainiza Saud

Observed names: N Saud, N. Saud, Norainiza SAUD, S. Norainiza, Saud Norainiza
OpenAlex ID: A5086534124
Effect of TiO 2 additions on Sn-0.7Cu-0.05Ni lead-free composite solder
2016 · M.I.I. Ramli, N. Saud, et al. · Microelectronics Reliability · 65
Zn-Sn Based High Temperature Solder - A Short Review
2013 · Sayyidah Amnah Musa, Mohd Arif Anuar Mohd Salleh, et al. · Advanced materials research · 33
Performance of Sn-3.0Ag-0.5Cu Composite Solder with Kaolin Geopolymer Ceramic Reinforcement on Microstructure and Mechanical Properties under Isothermal Ageing
2021 · Nur Syahirah Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 16
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Transient liquid phase bonding for solder-a short review
2019 · Norainiza Saud, Rita Mohd Said · IOP Conference Series Materials Science and Engineering · 16
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Microstructure and growth kinetic study in Sn–Cu transient liquid phase sintering solder paste
2020 · R. Mohd Said, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 14
Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg
2022 · C.Y. Tan, M.A.A. Mohd Salleh, et al. · Materials Today Communications · 12
A Comparative Study of Solder Properties of Sn-0.7Cu Lead-free Solder Fabricated Via the Powder Metallurgy and Casting Methods
2013 · Mohd Arif Anuar Mohd Salleh, Mohd Mustafa Al Bakri Abdullah, et al. · Revista de Chimie · 11
Influence of Non-Metallic Particles Addition on Wettability, Intermetallic Compound Formation and Microhardness of Sn-0.7Cu Lead Free Solder Paste
2018 · N.S. Mohamad Zaimi, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 10
Isothermal Aging Affect to the Growth of Sn-Cu-Ni-1 wt.% TiO2 Composite Solder Paste
2016 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Key engineering materials · 10
Corrosion Performance of Reinforcement Bar in Geopolymer Concrete Compare with its Performance in Ordinary Portland Cement Concrete: A Short Review
2013 · Z.F. Farhana, H. Kamarudin, et al. · Advanced materials research · 10
Influence of 1.5 wt.% Bi on the Microstructure, Hardness, and Shear Strength of Sn-0.7Cu Solder Joints after Isothermal Annealing
2021 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Materials · 8
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Influence of Bismuth in Sn-Based Lead-Free Solder – A Short Review
2018 · Nurul Razliana Abdul Razak, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 8
Wettability and Shear Strength of Sn-Cu-Ni-xSi3N4 Composite Solder
2016 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Key engineering materials · 7
Microstructural Observation and Phase Analysis of Sn-Cu-Ni (SN100C) Lead Free Solder with Addition of Micron-Size Silicon Nitride (Si3N4) Reinforcement
2015 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Applied Mechanics and Materials · 7
The Effect of Germanium Addition on the Lead-free Solder Alloys: A Short Review
2020 · Chi Ying Tan, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 6
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Growth Kinetic of Sn-0.7Cu-0.05Ni Solder Paste Subjected to Isothermal Aging
2018 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Diffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena · 6
Effect of TiO2 on the Formation of Primary and Interfacial Cu6Sn5 in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering
2016 · Mohd Arif Anuar Mohd Salleh, R.M. Said, et al. · Key engineering materials · 6
Effect of TiO2 Reinforcement on Microstructure and Microhardness of Low-Silver SAC107 Lead-Free Solder Composite Solder
2014 · Norhayanti Mohd Nasir, Norainiza Saud, et al. · Materials science forum · 6
Mixed Assembly of Lead-free Solder Joint: A Short Review
2022 · Rita Mohd Said, Mohd Arif Anuar Mohd Salleh, et al. · Journal of Physics Conference Series · 5
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The Effect of Thermal Annealing on the Microstructure and Mechanical Properties of Sn-0.7Cu-xZn Solder Joint
2021 · Mohd Izrul Izwan Ramli, Mohd Arif Anuar Mohd Salleh, et al. · Metals · 5
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The Study of Interfacial Reaction between SnAgCu (SAC) Lead-free Solder Alloys and Copper Substrate: A Short Review
2020 · Chi Ying Tan, Mohd Arif Anuar Mohd Salleh, et al. · IOP Conference Series Materials Science and Engineering · 5
The Effect of Silicon Nitride Addition on Microstructure and Microhardness of SN100C Solder Alloy Using Powder Metallurgy
2014 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Materials science forum · 5
Effects of vanadium on the properties of Sn-3wt%Ag-5wt%Cu solder alloy
2024 · C. Y. Tan, M. A. A. Mohd Salleh, et al. · Journal of Materials Science Materials in Electronics · 4
Physical and Mechanical Behaviors of SnCu-Based Lead-Free Solder Alloys with an Addition of Aluminium
2015 · Nisrin Adli, Nurul Razliana Abdul Razak, et al. · Applied Mechanics and Materials · 4
The Effect of Micron-Size Silicon Additions on Microstructure, Microhardness and Thermal Properties of Sn-Cu-Ni Solder Alloy
2015 · Mohd Izrul Izwan Ramli, Norainiza Saud, et al. · Materials science forum · 4
Works count: 75
Citation count: 345
H-index: 10
I10-index: 10
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