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Katsuhiko Tokushige
Observed names:
K. Tokushige,
Katsuhiko TOKUSHIGE
Institution:
Ebara (Japan)
Observed institution:
Ebara (Japan)
OpenAlex ID:
A5044744198
Stress Corrosion Cracking of Cu Interconnects during CMP with a Cu/Porous Low-k Structure
2005
·
Masako Kodera
, Shin-ichiro Uekusa
, et al.
·
Journal of The Electrochemical Society
·
17
Stress Analyses during Chemical Mechanical Planarization Processing with Cu/Porous Low-k Structures of LSI Devices
2005
·
Masako Kodera
, Akira Fukuda
, et al.
·
Japanese Journal of Applied Physics
·
6
Electrochemical Reactions During Ru Chemical Mechanical Planarization and Safety Considerations
2011
·
Shohei Shima
, Yutaka Wada
, et al.
·
Japanese Journal of Applied Physics
·
5
PDF
Development of data logging system for chemical mechanical polishing and its application for process control
2002
·
S. Matsuzaki
, A. Tanzawa
, et al.
·
IEEE Transactions on Semiconductor Manufacturing
·
5
Development of post-CMP cleanup processing for Cu/low-k devices
2006
·
Masako Kodera
, Shin-Ichiro Uekusaka
, et al.
·
Electronics and Communications in Japan (Part II Electronics)
·
4
Analysis on Copper Photocorrosion Induced by Illuminance in Chemical Mechanical Planarization Equipment Using Photodiode and Quartz Crystal Microbalance
2010
·
Shohei Shima
, Yutaka Wada
, et al.
·
Japanese Journal of Applied Physics
·
2
PDF
Spin-on dielectric stack low-k integration with EB curing technology for 45nm-node and beyond
2004
·
H. Nagai
, K. Maekawa
, et al.
·
IEEE International Interconnect Technology Conference (IITC)
·
2
20304 The Effect of Dissolved Oxygen and Conductivity of Deionized Water on Copper Corrosion
2010
·
Shohei SHIMA
, Katsuhiko TOKUSHIGE
, et al.
·
The Proceedings of Conference of Kanto Branch
21103 Quantitative Evaluation of Mechanical Property for Copper Surface Reacted with Slurry Chemicals
2009
·
Shohei SHIMA
, Katsuhiko TOKUSHIGE
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
21414 Trial of Cu Clear Process with Electro-Chemical Mechanical Polishing (ECMP)
2008
·
Itsuki KOBATA
, Yutaka WADA
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
21412 Evaluation of Mechanical Properties of Copper Surface Reacting in CMP Slurry with AFM
2008
·
Shohei SHIMA
, Katsuhiko TOKUSHIGE
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
Comparison of the Planarization Technologies for the Next Generation
2007
·
Itsuki Kobata
, Yutaka Wada
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
Effects of Oxidizer in Metal CMP Slurry on Open Circuit Potential Change during Metal Polishing
2007
·
Shohei Shima
, Shintaro Kamioka
, et al.
·
International Conference on Solid State Devices and Materials (SSDM)
21710 Comparison of the Planarization Technologies for the Next Generation
2007
·
Itsuki KOBATA
, Yutaka WADA
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
21712 Influence of geometry of CMP pad on performance of CMP process
2007
·
Yu ISHII
, Katsuhiko TOKUSHIGE
, et al.
·
The Proceedings of Conference of Kanto Branch
PDF
20703 Stress Analyses during CMP Processing with the Cu/porous low-k Suturcture
2005
·
Masako Kodera
, Shin-ichiro Uekusa
, et al.
·
The Proceedings of Conference of Kanto Branch
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Works count:
16
Citation count:
41
H-index:
4
I10-index:
1
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