Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
R. McGouey
Observed names:
R. P. McGouey,
Richard P. McGouey
Institutions:
IBM (United States),
IBM Research - Thomas J. Watson Research Center
Observed institutions:
IBM (United States),
IBM Research - Thomas J. Watson Research Center
OpenAlex ID:
A5046357995
High-speed signal propagation on lossy transmission lines
1990
·
A. Deutsch
, G. V. Kopcsay
, et al.
·
IBM Journal of Research and Development
·
210
A study of the chemical and physical interaction between copper and polyimide
1989
·
D-Y. Shih
, J. Paraszczak
, et al.
·
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
·
45
The use of organosilicon polymers in multilayer plasma resist processing
1987
·
J. Paraszczak
, E. Babich
, et al.
·
Microelectronic Engineering
·
12
Fabrication and performance studies of multilayer polymer/metal interconnect structures for packaging applications
2002
·
J. Paraszczak
, J. Cataldo
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
Factors affecting the interconnection resistance and yield in multilayer polyimide/copper structures
1993
·
D.-Y. Shih
, H.L. Yeh
, et al.
·
IEEE Transactions on Components Hybrids and Manufacturing Technology
·
8
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
1990
·
D‐Y. Shih
, J. Cataldo
, et al.
·
Journal of Vacuum Science & Technology A Vacuum Surfaces and Films
·
7
Silylation of resist materials using di- and polyfunctional organosilicon compounds
1990
·
E. Babich
, J. Paraszczak
, et al.
·
Microelectronic Engineering
·
6
Chemical And Physical Aspects Of Multilayer Resist Processing
1988
·
J. Paraszczak
, E. Babich
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
6
Comparison of vapor and liquid phase silylation processes of photoresists
1991
·
E. Babich
, J. Paraszczak
, et al.
·
Microelectronic Engineering
·
5
In-plane solvent diffusion in a soluble polyimide lift-off structure
1990
·
D-Y. Shih
, E. Galligan
, et al.
·
Journal of Vacuum Science & Technology B Microelectronics Processing and Phenomena
·
5
Factors affecting the interconnection resistance and yield in the fabrication of multilayer polyimide/metal thin film structures
2003
·
D.-Y. Shih
, H. Yeh
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Adhesion properties of a structural etch stop material for use in multilayer electronic wiring structures
1995
·
Ruud A. Haring
, Sharon L. Nunes
, et al.
·
Journal of materials research/Pratt's guide to venture capital sources
·
4
Electrical characteristics of lossy interconnections for high-performance computer applications
1991
·
Alina Deutsch
, Gerard V. Kopcsay
, et al.
·
Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE
·
3
Fabrication of contiguous-disk magnetic bubble devices
1980
·
Kie Ahn
, D. Cox
, et al.
·
IEEE Transactions on Magnetics
·
3
RBS analysis of Si diffusion in photoresist during silylation
1990
·
P. Madakson
, S. Nunes
, et al.
·
Nuclear Instruments and Methods in Physics Research Section B Beam Interactions with Materials and Atoms
·
1
Show more works
View as search
Works count:
15
Citation count:
329
H-index:
6
I10-index:
4
Year
Topic
Type
