Product
Help
Pricing
About
Jobs
Log in
Get started
Author
Add to collection
Mustafa Özkök
Observed name:
Mustafa Ozkok
Observed institution:
Atotech (Germany)
OpenAlex ID:
A5047583078
Adjustable EMI Shielding on Electronic Packages Realized by Electrolytic Plating
2019
·
Mustafa Ozkok
, Sven Lamprecht
, et al.
·
IEEE CPMT Symposium Japan (ICSJ)
·
5
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
2018
·
Mustafa Ozkok
, Sven Lamprecht
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
5
Forming solder filet on leadframe edges of a QFN with immersion tin
2013
·
Mustafa Ozkok
, Hubertus Mertens
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Direct EP and direct EPAG — Novel surface finishes for gold-, copper wire bonding and soldering applications
2012
·
Mustafa Ozkok
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
3
Innovative Electrolytic Flash Copper Plating Equipment for Enhanced mSAP Via Reliability and Efficiency
2025
·
Mustafa Özkök
, Andreas Schatz
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
A Novel Horizontal Copper Pattern Plating System with High Throughput
2019
·
Mustafa Ozkok
, Andreas Schatz
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Enhancing Productivity for IC-substrate manufacturing by using a novel Copper Electrolyte for Semi Additive Plating
2018
·
Angelo Ferro
, Mustafa Ozkok
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Is High Phosphorus Content in the Nickel Layer a Root Cause for Black Pad on ENIG?
2014
·
Mustafa Özkök
, Joe McGurran
, et al.
·
Regional Events
Is a High Phosphorus Content in the Nickel Layer a Root Cause for “Black Pad” on Enig Finishes?
2013
·
Mustafa Özkök
, Joe McGurran
, et al.
·
SMTA International
Is a High Phosphorus Content in the Nickel Layer a Root Cause for “Black Pad” on ENIG Finishes?
2013
·
Mustafa Özkök
, Joe McGurran
, et al.
·
Journal of Surface Mount Technology
Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancement
2013
·
Mustafa Özkök
, Hubertus Mertens
, et al.
·
IMAPSource Proceedings
PDF
Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.
2013
·
Mustafa Ozkok
, Sven Lamprecht
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Palladium surface finishes for copper wire bonding (Part I: The selection of surface finishes)
2011
·
Mustafa Ozkok
, Bill Kao
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
Copper Wire Bonding on Pure Palladium Surface Finishes – Eliminating the Gold Cost from the Electronic Package
2011
·
Mustafa Özkök
, Hugh Roberts
, et al.
·
Journal of Surface Mount Technology
Resistance of Common PWB Surface Finishes Against Corrosion in Harsh Environments
2010
·
Mustafa Özkök
, Mario Gensicke
, et al.
·
SMTA International
Show more works
View as search
Works count:
15
Citation count:
17
H-index:
3
I10-index:
Year
Topic
Type
