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Harald Wiesbauer
Observed institution:
EV Group (Austria)
OpenAlex ID:
A5047831312
Recent progress in thin wafer processing
2013
·
Thomas Uhrmann
, Thorsten Matthias
, et al.
·
IEEE International D Systems Integration Conference
·
19
Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
2014
·
Jürgen Burggraf
, Julian Bravin
, et al.
·
ECS Transactions
·
4
Temporary bonding on the move towards high volume: A status update on cost-of-ownership
2014
·
Thomas Uhrmann
, Jurgen Burggraf
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Laser Debonding for 2.5D, 3D and Emerging Advanced Packaging Solutions
2017
·
T. Uhrmann
, Elisabeth Brandl
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
2
Low Temperature Wafer Bonding for 3D Applications
2014
·
Juergen Burggraf
, Julian Bravin
, et al.
·
ECS Transactions
·
2
Monolithic Thin Wafer Stacking Using Low Temperture Direct Bonding
2014
·
Jürgen Burggraf
, Julian Bravin
, et al.
·
ECS Meeting Abstracts
·
1
Temporary Bonding Cost Of Ownership: The link between low total thickness variation and chip yield
2014
·
Thomas Uhrmann
, Jürgen Burggraf
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
·
1
An innovative and low cost Bi-layer method for temporary bonding
2013
·
Jurgen Burggraf
, Harald Wiesbauer
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Temporary-bonding and LowTemp® debonding technology for various applications
2012
·
Masaya Kawano
, Takumi Komatsu
, et al.
·
International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)
·
1
Key Criteria for Successful Integration of Laser Debonding
2016
·
Elisabeth Brandl
, Thomas Uhrmann
, et al.
·
Wafer-Level Packaging Symposium
Thin WLFO and based WLSiP enabling WL3D, realized using Temporary Reconstituted Panel Bonding Technology
2016
·
Steffen Kroehnert
, Jose Campos
, et al.
·
Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)
Temporary Wafer Carrier Solutions for Thin FOWLP and eWLB-based PoP
2015
·
Jose Campos
, André Cardoso
, et al.
·
Wafer-Level Packaging Symposium
Temporary Bonding on the Move Towards High Volume: A Status Update on Cost-of-Ownership
2014
·
Thomas Uhrmann
, Jürgen Burggraf
, et al.
·
Wafer-Level Packaging Symposium
Low Temperature Fusion Wafer Bonding for Wafer-Level 3D Integration Applications
2013
·
Juergen Burggraf
, Julian Bravin
, et al.
·
ECS Meeting Abstracts
PDF
Equipment and Process Solutions for Low Cost High Volume Manufacturing Of 3D Integrated Devices
2012
·
Markus Wimplinger
, Jürgen Burggraf
, et al.
·
Pan Pacific Symposium
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Works count:
15
Citation count:
34
H-index:
3
I10-index:
1
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