Work

Temporary bonding on the move towards high volume: A status update on cost-of-ownership

Year: 2014

Type: conference-paper

Source: IEEE Electronics Packaging Technology Conference (EPTC)

DOI: 10.1109/eptc.2014.7028339

Authors: Thomas Uhrmann, Jurgen Burggraf, Harald Wiesbauer, Julian Bravin, Thorsten Matthias, Markus Wimplinger, Paul Lindner

Institution: EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2015332148

FWCI: 0.803

Cites:

Cited by: 3

Related to: 10