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Paul F. Lindner

Observed names: P. Lindner, Paul Lindner
ORCID: 0000-0001-5384-1864
Observed ORCID: 0000-0001-5384-1864
OpenAlex ID: A5042006175
The Internet Gopher Protocol (a distributed document search and retrieval protocol)
1993 · F. Anklesaria, M. McCahill, et al. · 90
Adhesive wafer bonding for MEMS applications
2003 · Viorel Dragoi, Thomas Glinsner, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 53
Wafer-level plasma activated bonding: new technology for MEMS fabrication
2007 · Viorel Dragoi, Gerald Mittendorfer, et al. · Microsystem Technologies · 46
Fabrication of 3D-photonic crystals via UV-nanoimprint lithography
2007 · Thomas Glinsner, Paul Lindner, et al. · Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures Processing Measurement and Phenomena · 26
3D interconnect through aligned wafer level bonding
2003 · P. Lindner, V. Dragoi, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 20
Recent progress in thin wafer processing
2013 · Thomas Uhrmann, Thorsten Matthias, et al. · IEEE International D Systems Integration Conference · 19
Plasma Activated Wafer Bonding of Silicon: In Situ and Ex Situ Processes
2006 · Viorel Dragoi, Paul Lindner · ECS Transactions · 19
New challenges for 300mm Si technology: 3D interconnects at wafer scale by aligned wafer bonding
2002 · V. Dragoi, P. Lindner, et al. · Materials Science in Semiconductor Processing · 18
Silicon-based wafer-level packaging for cost reduction of high brightness LEDs
2011 · Thomas Uhrmann, Thorsten Matthias, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 16
Chemie der Hefe und der alkoholischen Gärung
1915 · Hans v. Euler, Paul Lindner · University of Michigan Library Repository · 15
CMOS image sensor wafer-level packaging
2011 · Thorsten Matthias, Gerald Kreindl, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14
Fully automated hot embossing processes utilizing high resolution working stamps
2009 · T. Glinsner, T. Veres, et al. · Microelectronic Engineering · 14
Mikroskopische Betriebskontrolle in den Gärungsgewerben mit einer Einführung in die technische Biologie, Hefenreinkultur und Infektionslehre
1901 · Paul Lindner · University of Michigan Library Repository · 14
Advanced wafer bonding solutions for TSV integration with thin wafers
2009 · Bioh Kim, Thorsten Matthias, et al. · IEEE International Conference on 3D System Integration (3DIC) · 13
Soft UV-based nanoimprint lithography for large-area imprinting applications
2007 · T. Glinsner, U. Plachetka, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12
Plasma activated wafer bonding for MEMS
2005 · V. Dragoi, S. Farrens, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12
Thin wafer processing and chip stacking for 3D integration
2010 · T. Matthias, B. Kim, et al. · Electronic System-Integration Technology Conference (ESTC) · 11
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding
2005 · F. Niklaus, R.J. Kumar, et al. · MRS Proceedings · 11
Monolithic IC integration key alignment aspects for high process yield
2014 · Thomas Uhrmann, Thomas Wagenleitner, et al. · IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference · 10
Fully automated hot embossing processes utilizing high resolution working stamps
2010 · T. Glinsner, T. Veres, et al. · Journal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena · 10
Wafer level packaging and 3D interconnect for IC technology
2003 · R. Islam, C. Brubaker, et al. · ASMC proceedings · 10
Wafer edge defect study of temporary bonded and thin wafers in TSV process flow
2015 · Jie Gong, Sumant Sood, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 8
(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration
2018 · Thomas Plach, Bernhard Rebhan, et al. · ECS Transactions · 7
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Comparison of Enabling Wafer Bonding Techniques for TSV Integration
2010 · Bioh Kim, Thorsten Matthias, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 7
The Optical Rotating Power of Organic Substances and Its Practical Applications
2007 · Paul Lindner · 7
Works count: 233
Citation count: 609
H-index: 13
I10-index: 21
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