Work

Monolithic IC integration key alignment aspects for high process yield

Year: 2014

Type: conference-paper

Source: IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference

DOI: 10.1109/s3s.2014.7028241

Authors: Thomas Uhrmann, Thomas Wagenleitner, Thomas Glinsner, Markus Wimplinger, Paul Lindner

Institution: EV Group (Austria)

Language: English

Topic: 3D IC and TSV technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2010689358

FWCI: 1.606

Cites: 3

Cited by: 10

Related to: 10