Author

Tetsuya Nishizuka

Observed names: T. Nishizuka, tetsuya nishizuka, 西塚哲也

ORCID: 0009-0001-7389-8187

Observed ORCID: 0009-0001-7389-8187

OpenAlex ID: A5049715812

1995 · Toshihisa Nozawa, Takashi Kinoshita, et al. · Japanese Journal of Applied Physics · 123

2022 · Sho Kumakura, Hironari Sasagawa, et al. · Japanese Journal of Applied Physics · 20

2022 · Angélique Raley, Lior Huli, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 18

2024 · Tetsuya Nishizuka, Ryo Igosawa, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 7

2025 · Takuya Sakagami, Donggook Kang, et al. · Advances in Patterning Materials and Processes · 2

2022 · Sho Kumakura, Takayuki Katsunuma, et al. · IEEE Electron Devices Technology & Manufacturing Conference (EDTM) · 1

2021 · Takahiro Shiozawa, Keisuke Yoshida, et al. · Advances in Patterning Materials and Processes

1997 · Y. Fukumoto, T. Nishizuka, et al. · International Symposium on Plasma Process-Induced Damage

1995 · T. Nozawa, Tetsuya Nishizuka, et al. · OSTI OAI (U.S. Department of Energy Office of Scientific and Technical Information)

1995 · 野沢俊久, 西塚哲也, et al.

1993 · Takashi Kinoshita, T. Nozawa, et al.

Works count: 11

Citation count: 171

H-index: 4

I10-index: 3