Work

New development technology for EUV tight pitch patterning

Year: 2025

Type: conference-paper

Source: Advances in Patterning Materials and Processes

DOI: 10.1117/12.3051009

Authors: Takuya Sakagami, Donggook Kang, Seiji Fujimoto, teruhiko kodama, satoru shimura, yuichi terashita, yuhei kuwahara, hisashi genjima, soichiro okada, yuichiro miyata, kenta ono, tetsuya nishizuka

Institutions: Tokyo Electron Kyushu Ltd (Japan), Tokyo Electron (Japan)

Language: English

Topic: Advancements in Photolithography Techniques

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4409677293

FWCI: 3.412

Cites: 2

Cited by: 2

Related to: 10