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Soichiro Okada

Observed name: soichiro okada
ORCID: 0000-0002-3192-1449
Observed ORCID: 0000-0002-3192-1449
OpenAlex ID: A5072285453
High-volume manufacturing equipment and processing for directed self-assembly applications
2014 · Mark Somervell, Takashi Yamauchi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 25
Driving DSA into volume manufacturing
2015 · Mark Somervell, Takashi Yamauchi, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 19
Outlook for high-NA EUV patterning: a holistic patterning approach to address upcoming challenges
2022 · Angélique Raley, Lior Huli, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 18
EUV Metal Oxide Resist Development Technology for Improved Sensitivity, Roughness and Pattern Collapse Margin for High Volume Manufacturing
2022 · Cong Que Dinh, Seiji Nagahara, et al. · Journal of Photopolymer Science and Technology · 13
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Enabling EUV pattern transfer by optimized under layer
2021 · Soichiro Okada, Keisuke Yoshida, et al. · Advances in Patterning Materials and Processes · 11
Co-optimization of lithographic and patterning processes for improved EPE performance
2017 · Mark J. Maslow, Vadim Timoshkov, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 11
Advanced development methods for high-NA EUV lithography
2023 · Cong Que Dinh, Seiji Nagahara, et al. · Advances in Patterning Materials and Processes · 9
Establishment of new process technology for EUV lithography
2023 · Yuhei Kuwahara, Shinichiro Kawakami, et al. · Advances in Patterning Materials and Processes · 7
Advanced processes in metal-oxide resists for high-NA EUV lithography
2024 · Cong Que Dinh, Seiji Nagahara, et al. · Advances in Patterning Materials and Processes · 6
Recent advances in EUV patterning in preparation towards high-NA EUV
2023 · Seiji Nagahara, Arnaud Dauendorffer, et al. · Advances in Patterning Materials and Processes · 6
Explorations of missing hole defect in EUV patterning
2020 · Hidetami Yaegashi, Arisa Hara, et al. · Advances in Patterning Materials and Processes · 5
Advanced Development Techniques for Extreme-Tight Pitch Patterning
2024 · Hikari Tomori, Cong Que Dinh, et al. · Journal of Photopolymer Science and Technology · 4
Understanding of Interactive Behaviors between Resist Film and Under-layer
2020 · Hidetami Yaegashi, Arisa Hara, et al. · Journal of Photopolymer Science and Technology · 4
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Pattern uniformity control in integrated structures
2017 · Shinji Kobayashi, Soichiro Okada, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Advanced development for contact-holes of metal-oxide resists
2023 · Cong Que Dinh, Seiji Nagahara, et al. · International Conference on Extreme Ultraviolet Lithography · 3
Monte Carlo simulation of edge placement error
2018 · Shinji Kobayashi, Soichiro Okada, et al. · Metrology, Inspection, and Process Control XXXVI · 3
Analyzing block placement errors in SADP patterning
2016 · Shinji Kobayashi, Soichiro Okada, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
New development technology for EUV tight pitch patterning
2025 · Takuya Sakagami, Donggook Kang, et al. · Advances in Patterning Materials and Processes · 2
Holistic litho-etch approach towards high NA EUV challenges
2023 · Soichiro Okada, Arnaud Dauendorffer, et al. · International Conference on Extreme Ultraviolet Lithography · 2
Approaches to enable patterning of tight pitches towards high NA EUV
2022 · Hiroki Tadatomo, Arnaud Dauendorffer, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 2
A holistic approach to extending resist material viability in extreme ultraviolet lithography
2025 · Soichiro Okada, Hisashi Genjima, et al. · International Conference on Extreme Ultraviolet Lithography · 1
Latest approaches toward high volume manufacturing with high numerical aperture EUV
2025 · Hisashi Genjima, Soichiro Okada, et al. · Advances in Patterning Materials and Processes · 1
Optimization of spin-on metal oxide resist performance via new development techniques on sub-30nm pitch patterning
2023 · Lior Huli, Kanzo Kato, et al. · Advances in Patterning Materials and Processes · 1
Fundamentals of EUV stack for improving patterning performance
2023 · Nanoka Miyahara, Soichiro Okada, et al. · Advances in Patterning Materials and Processes · 1
Fundamental study of inorganic middle layer film for EUV patterning
2022 · Soichiro Okada, Keisuke Yoshida, et al. · Advances in Patterning Materials and Processes · 1
Works count: 36
Citation count: 162
H-index: 7
I10-index: 6
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