Holistic litho-etch approach towards high NA EUV challenges
Year: 2023
Type: conference-abstract
DOI: 10.1117/12.2687568
Authors: Soichiro Okada, Arnaud Dauendorffer, Yuhei Kuwahara, Satoru Shimura, Philippe Foubert, Danilo De Simone, Cong Que Dinh, Ken Ando, Atsushi Tsuboi, Nobuyuki Fukui, Arame Thiam, Yannick Feurprier, Kathleen Nafus
Institutions: Tokyo Electron Kyushu Ltd (Japan), IMEC, Tokyo Electron (Japan)
Language: English
Subfield: Electrical and Electronic Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W4388895992