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Author

Yuhei Kuwahara

Observed names: Kuwahara Yuhei, yuhei kuwahara
OpenAlex ID: A5012392064
Advances and challenges in dual-tone development process optimization
2009 · Carlos Fonseca, Mark Somervell, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 22
Resist fundamentals for resolution, LER, and sensitivity (RLS) performance tradeoffs and their relation to micro-bridging defects
2009 · Benjamin Rathsack, Kathleen Nafus, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 17
EUV Metal Oxide Resist Development Technology for Improved Sensitivity, Roughness and Pattern Collapse Margin for High Volume Manufacturing
2022 · Cong Que Dinh, Seiji Nagahara, et al. · Journal of Photopolymer Science and Technology · 13
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Novel metal containing resists for EUV lithography extendibility
2016 · Danilo De Simone, Safak Sayan, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 12
Advanced development methods for high-NA EUV lithography
2023 · Cong Que Dinh, Seiji Nagahara, et al. · Advances in Patterning Materials and Processes · 9
Advances in dual-tone development for pitch frequency doubling
2010 · Carlos Fonseca, Mark Somervell, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 8
Establishment of new process technology for EUV lithography
2023 · Yuhei Kuwahara, Shinichiro Kawakami, et al. · Advances in Patterning Materials and Processes · 7
Advanced processes in metal-oxide resists for high-NA EUV lithography
2024 · Cong Que Dinh, Seiji Nagahara, et al. · Advances in Patterning Materials and Processes · 6
Recent advances in EUV patterning in preparation towards high-NA EUV
2023 · Seiji Nagahara, Arnaud Dauendorffer, et al. · Advances in Patterning Materials and Processes · 6
Advanced multi-patterning using resist core spacer process for 22nm node and beyond
2012 · Yuhei Kuwahara, Satoru Shimura, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6
Finite element modeling of PAG leaching and water uptake in immersion lithography resist materials
2008 · Ben M. Rathsack, Steven Scheer, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 6
Dry development rinse process for ultimate resolution improvement via pattern collapse mitigation
2015 · Safak Sayan, Zheng Tao, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 5
Advanced Development Techniques for Extreme-Tight Pitch Patterning
2024 · Hikari Tomori, Cong Que Dinh, et al. · Journal of Photopolymer Science and Technology · 4
EUV patterning improvement toward high-volume manufacturing
2015 · Yuhei Kuwahara, Koichi Matsunaga, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 4
Advanced development for contact-holes of metal-oxide resists
2023 · Cong Que Dinh, Seiji Nagahara, et al. · International Conference on Extreme Ultraviolet Lithography · 3
Holistic litho-etch development to address patterning challenges towards high NA EUV
2022 · Seiji Nagahara, Arnaud Dauendorffer, et al. · International Conference on Extreme Ultraviolet Lithography · 3
Manufacturability improvements in EUV resist processing toward NXE:3300 processing
2014 · Yuhei Kuwahara, Koichi Matsunaga, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 3
New development technology for EUV tight pitch patterning
2025 · Takuya Sakagami, Donggook Kang, et al. · Advances in Patterning Materials and Processes · 2
Patterning optimization for single exposure BLP and SNLP DRAM layers with 0.33NA and 0.55NA EUV lithography
2025 · Van Tuong Pham, Victor M. Blanco Carballo, et al. · Advances in Patterning Materials and Processes · 2
Holistic litho-etch approach towards high NA EUV challenges
2023 · Soichiro Okada, Arnaud Dauendorffer, et al. · International Conference on Extreme Ultraviolet Lithography · 2
Approaches to enable patterning of tight pitches towards high NA EUV
2022 · Hiroki Tadatomo, Arnaud Dauendorffer, et al. · Advanced Etch Technology and Process Integration for Nanopatterning · 2
Manufacturability improvements in EUV resist processing toward NXE:3300 processing
2014 · Yuhei Kuwahara, Koichi Matsunaga, et al. · Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE · 2
A holistic approach to extending resist material viability in extreme ultraviolet lithography
2025 · Soichiro Okada, Hisashi Genjima, et al. · International Conference on Extreme Ultraviolet Lithography · 1
Latest approaches toward high volume manufacturing with high numerical aperture EUV
2025 · Hisashi Genjima, Soichiro Okada, et al. · Advances in Patterning Materials and Processes · 1
Novel technologies in coater/developer to improve the defectivity for advanced EUV patterning materials
2022 · Yuya Kamei, Tomoya Onitsuka, et al. · Advances in Patterning Materials and Processes · 1
Works count: 33
Citation count: 148
H-index: 7
I10-index: 4
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