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T. E. Wong

Observed names: T. Eric Wong, T.E. Wong
OpenAlex ID: A5050287880
Development of BGA solder joint vibration fatigue life prediction model
2003 · T.E. Wong, B.A. Reed, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 53
Durability/reliability of BGA solder joints under vibration environment
2002 · T.E. Wong, F.W. Palmieri, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 43
Under-filled BGA solder joint vibration fatigue damage
2003 · T.E. Wong, F.W. Palmieri, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 22
On the Effects of Elastic Nonlinearity in Metals
1988 · T. E. Wong, G. C. Johnson · Journal of Engineering Materials and Technology · 12
J-Lead Solder Joint Thermal Fatigue Life Model
1999 · T. E. Wong, L. A. Kachatorian, et al. · Journal of Electronic Packaging · 9
Gull-Wing Solder Joint Fatigue Life Sensitivity Evaluation
1997 · T. E. Wong, L. A. Kachatorian, et al. · Journal of Electronic Packaging · 8
Spiral Flexure Bearing
1995 · T. E. Wong, R. B. Pan, et al. · Springer eBooks · 8
Acoustoelasticity in Layered Composites
1990 · G. T. Mase, T. E. Wong, et al. · Journal of Engineering Materials and Technology · 7
CBGA solder joint thermal fatigue life estimation by a simple method
2004 · T.E. Wong, C.Y. Lau, et al. · Soldering and Surface Mount Technology · 6
Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint
2000 · T. E. Wong, F. W. Palmieri, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 6
COTS BGA Thermal Fatigue Test for Avionics Applications
2003 · H. S. Fenger, T. E. Wong · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 4
Vibration and thermo-mechanical durability assessments in advanced electronic package interconnects
2004 · T.E. Wong, H.S. Fenger · IEEE Electronic Components and Technology Conference (ECTC) · 3
CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method
2003 · T. E. Wong, C. Y. Lau, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 3
Bus Bar Solder Joint Durability Evaluation
1996 · T. Eric Wong, Harold M. Cohen · Journal of Electronic Packaging · 3
Acoustoelasticity in Fiber Reinforced Composites
1989 · G. T. Mase, T. E. Wong, et al. · Review of Progress in Quantitative Nondestructive Evaluation · 3
Ultrasonic Evaluation of the Nonlinearity of Metals from a Design Perspective
1988 · T. E. Wong, G. C. Johnson · Review of Progress in Quantitative Nondestructive Evaluation · 3
Vibration Fatigue Test of Surface Mount Electronic Components
2003 · T. E. Wong, H. S. Fenger · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) · 2
The acoustoelastic response of a textured material during elastic-plastic deformation
1990 · T. E. Wong, G. C. Johnson · Metallurgical Transactions A · 2
Fatigue Damage Evaluation for Microelectronic Components Subjected to Vibration
2011 · T. E. Wong · 1
Thermal Fatigue Life Prediction Model of CCGA Tin-Lead and Lead-Free Interconnects
2006 · T. E. Wong, C. Chu · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1
Design of Experiments in Ball Grid Array Thermal Fatigue Life Tests
2002 · T. E. Wong, C. Y. Lau, et al. · ASME International Mechanical Engineering Congress and Exposition (IMECE) · 1
Bolt cutter functional evaluation
1994 · S. Goldstein, T. E. Wong, et al. · NASA Technical Reports Server (NASA) · 1
The Role of Texture Development and Dislocations in Acoustoelasticity during Plane Deformation
1987 · George C. Johnson, T. E. Wong, et al. · Review of Progress in Quantitative Nondestructive Evaluation · 1
Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method
2007 · T. E. Wong, C. Chu · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Finite Element Analysis of Ball Grid Arrays Subjected to Random Vibration Tests
2001 · Frederick Palmieri, Harold M. Cohen, et al.
Works count: 25
Citation count: 202
H-index: 7
I10-index: 4
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