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Heungsoo Park

Observed names: H. Park, H.-S. Park, H.S. Park, Heung-Soo Park, Hongsoo PARK
Institution: Yonsei University
ORCID: 0000-0003-1175-9656
Observed ORCID: 0000-0003-1175-9656
OpenAlex ID: A5052045695
Chemical bonding states and dopant redistribution of heavily phosphorus-doped epitaxial silicon films: Effects of millisecond laser annealing and doping concentration
2019 · H.-Y. Ryu, M. Lee, et al. · Applied Surface Science · 18
Control of Microscratches in Chemical-Mechanical Polishing Process for Shallow Trench Isolation
1998 · Heungsoo Park, Kwang-Bok Kim, et al. · Japanese Journal of Applied Physics · 17
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Plasma-enhanced atomic layer deposition of low temperature silicon dioxide films using di-isopropylaminosilane as a precursor
2018 · Donghyuk Shin, Heungseop Song, et al. · Thin Solid Films · 15
The Effect of Annealing Treatment on the Distribution of Deuterium in Silicon and in Silicon/Silicon Oxide Systems
1992 · Heungsoo Park, C. R. Helms · Journal of The Electrochemical Society · 14
Study on temperature-dependent growth characteristics of germanium oxide film by plasma-enhanced atomic layer deposition
2023 · Donghyuk Shin, Heungsoo Park, et al. · Thin Solid Films · 10
Properties of low-resistivity molybdenum metal thin film deposited by atomic layer deposition using MoO2Cl2 as precursor
2024 · So Young Kim, Chunghee Jo, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 9
Growth behavior and film properties of titanium dioxide by plasma-enhanced atomic layer deposition with discrete feeding method
2019 · Heungseop Song, Donghyuk Shin, et al. · AIP Advances · 9
Design and optimization of 700V HVIC technology with multi-ring isolation structure
2013 · Nam-Chil Moon, Kyung-Wook Kwon, et al. · IEEE International Symposium on Power Semiconductor Devices and ICs/Proceedings of the International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices & ICs/Proceedings of the ... International Symposium on Power Semiconductor Devices and ICs · 9
Recrystallization and activation of ultra-high-dose phosphorus-implanted silicon using multi-pulse nanosecond laser annealing
2020 · Hyunsu Shin, Juhee Lee, et al. · Japanese Journal of Applied Physics · 8
Plasma charge-induced corrosion of tungsten-plug vias in CMOS devices
2003 · Jang-Eun Lee, Ju-Hyuk Chung, et al. · IEEE International Interconnect Technology Conference (IITC) · 6
In Situ Removal of Native Oxides from Silicon Surfaces Using Anhydrous Hydrogen Fluoride Gas
1999 · Heungsoo Park · Electrochemical and Solid-State Letters · 5
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Thermal stability of molybdenum–silicon nitride–silicon Schottky diodes
1991 · Heungsoo Park, C. R. Helms · Journal of Applied Physics · 5
Super-conformal TiN thin film deposition by carrier pulse purge atomic layer deposition system: Chamber design optimization with computational fluid dynamics
2023 · Jinho Jeon, Heungsoo Park, et al. · Thin Solid Films · 4
Process integration of CVD Cu seed using ALD Ru glue layer for sub-65nm Cu interconnect
2004 · S.-M. Choi, K.-C. Park, et al. · Symposium on VLSI Technology · 4
Synthesis of highly conformal titanium nitride films via tert-butyl chloride-assisted atomic layer deposition
2023 · Jinho Jeon, Heungsoo Park, et al. · Applied Surface Science · 3
Effect of plasma and heat treatment on silicon dioxide films by plasma-enhanced atomic layer deposition
2019 · Donghyuk Shin, Heungseop Song, et al. · Journal of Vacuum Science & Technology A Vacuum Surfaces and Films · 3
Effect of Surface Iron on Gate Oxide Integrity and its Removal from Silicon Surfaces
1993 · Heungsoo Park, C. R. Helms, et al. · MRS Proceedings · 3
Generalized Model of Metal Bonding and Cleaning from Wafer Surfaces
1993 · C. R. Helms, Heungsoo Park · MRS Proceedings · 3
Method for contact resistivity measurements on highly phosphorus-doped silicon using a multiline transmission line model
2021 · Hyunsu Shin, Seran Park, et al. · Journal of the Korean Physical Society · 2
A New Post-Treatment for Chemical-Mechanical Polishing Process of Very Large-Scale Integrated Circuit Tungsten Vias
1998 · Heungsoo Park, Yong-Jun Cho, et al. · Japanese Journal of Applied Physics · 2
Effect of Surface Iron on Photoconductivity Carrier Recombination Lifetime of p‐Type Silicon
1998 · Heungsoo Park, C. R. Helms, et al. · Journal of The Electrochemical Society · 2
Thermally Driven In-Situ Removal of Native Oxide Using Anhydrous Hydrogen Fluoride
1993 · Pushkar P. Apte, Heungsoo Park, et al. · MRS Proceedings · 1
Synthesis of high conformalty Ti-Six-N films using (CH3)3CCl and SiH4; density functional theory simulation and film characterization
2024 · Jinho JEON, Hongsoo PARK, et al. · Thin Solid Films
Activation and Recrystallization of Ultra-High-Dose Phosphorus-Implanted Silicon using Multi-Pulse Nanosecond Laser Annealing
2019 · H. Shin, H.-Y. Ryu, et al. · International Conference on Solid State Devices and Materials (SSDM)
Thermally Robust Ohmic Layer Formation and Stable Electrical Properties in TiCl4-Ti/TiN Process Using Cyclic Plasma Method
2011 · Seonghwee Cheong, E.O. Lee, et al. · ECS Meeting Abstracts
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Works count: 28
Citation count: 152
H-index: 8
I10-index: 5
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