A New Post-Treatment for Chemical-Mechanical Polishing Process of Very Large-Scale Integrated Circuit Tungsten Vias
Year: 1998
Type: article
DOI: 10.1143/jjap.37.3871
Authors: Heungsoo Park, Yong-Jun Cho, Jae-In Song, Young-Bum Koh, Moon-Yong Lee
Institution: Samsung Electronics (South Korea)
Language: English
Subfield: Industrial and Manufacturing Engineering
Field: Engineering
Domain: Physical Sciences
Open Access status: closed
OpenAlex ID: W2078090770