Author

Mike Morianz

Observed name: M. Morianz

Institution: AT&S (Austria)

Observed institutions: TU Wien, AT&S (Austria)

OpenAlex ID: A5052199167

A PCB-Embedded 1.2 kV SiC MOSFET Half-Bridge Package for a 22 kW AC–DC Converter

2022 · Jack S. Knoll, Gibong Son, et al. · IEEE Transactions on Power Electronics · 48

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Design and Analysis of a PCB-Embedded 1.2 kV SiC Half-Bridge Module

2021 · Jack Knoll, Gibong Son, et al. · IEEE Energy Conversion Congress and Exposition (ECCE) · 21

A PCB-Embedded 1.2 kV SiC MOSFET Package With Reduced Manufacturing Complexity

2023 · Jack Knoll, Christina DiMarino, et al. · IEEE Open Journal of Power Electronics · 15

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Investigation of a power module with double sided cooling using a new concept for chip embedding

2016 · Hannes Stahr, Mike Morianz, et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 9

Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

2014 · Katerina Macurova, Paul Angerer, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 9

Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages During the Assembly Process

2015 · K. Macurova, R. Bermejo, et al. · Journal of Microelectronics and Electronic Packaging · 8

Numerical investigation of the process of embedding components into Printed Circuit Boards

2011 · Martin Pletz, Raul Bermejo, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 6

Stress and Deflection Development During Die Embedding into Printed Circuit Boards

2015 · K. Macurova, P. Angerer, et al. · Materials Today Proceedings · 5

Multi-physics simulation of the component attachment within embedding process

2013 · K. Macurova, A. Kharicha, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

Thermal benchmark of a classic and novel embedded high-power 3-phase inverter Bridge

2016 · H. Stahr, M. Unger, et al. · Electronic System-Integration Technology Conference (ESTC) · 3

Miniaturized power-diode package with superior thermal performance using embedding technology

2016 · Michael Unger, Hannes Stahr, et al. · International Spring Seminar on Electronics Technology · 3

Local strength measurement technique for miniaturised silicon-based components

2011 · Marco Deluca, Raul Bermejo, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 3

A High Power Density SiC MOSFET Inverter Design and Thermal Validation for EV Traction Application

2023 · Kaushik Mirdoddi, K Gopikrishnan, et al. · European Conference on Power Electronics and Applications · 2

Powering Up Electronics—Latest Developments and Concepts for Packaging of Electronics in Automotive Systems

2019 · Johannes Stahr, Mike Morianz · Lecture notes in mobility · 2

Thermal characterization of a 500W motor driver module with embedded power transistors

2017 · Johann Nicolics, Michael Unger, et al. · International Spring Seminar on Electronics Technology · 2

Low Parasitic Loop Inductance Design and Characterization of a 1200 V, 200 A SiC MOSFET Half-Bridge PCB-embedded Power Module

2025 · Aditya Bhalotia, Sorra Ranjit, et al. · IEEE ... Workshop on Control and Modeling for Power Electronics · 1

Latest Reliable Power Electronics Technologies for Zero-Emission

2025 · Christoph Abart, Katharina Berberich, et al. · Lecture notes in mobility · 1

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Environmental aspects of new embedded power modules with 500 W and 50 kW

2017 · Manuela Franz, Michael Unger, et al. · International Spring Seminar on Electronics Technology · 1

Wide-bandgap Technologies in Electronic Power Circuits for Electrified Vehicles and Charging Infrastructures

2026 · Christoph Abart, Olcay Bay, et al. · Lecture notes in mobility

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Next Generation of Power Electronics Module Packaging

2021 · Hannes Stahr, Mike Morianz

Comparison of Different Methods for Stress and Deflection Analysis in Embedded Die Packages during the Assembly Process

2014 · K. Macurova, R. Bermejo, et al. · IMAPSource Proceedings

Works count: 21

Citation count: 144

H-index: 6

I10-index: 3