Work

Multi-physics simulation of the component attachment within embedding process

Year: 2013

Type: conference-paper

Source: International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

DOI: 10.1109/eurosime.2013.6529914

Authors: K. Macurova, A. Kharicha, M. Pletz, M. Mataln, R. Bermejo, R. Schongrundner, T. Krivec, T. Antretter, W. Maia, M. Morianz, M. Brizoux

Institutions: Materials Center Leoben (Austria), Montanuniversität Leoben, AT&S (Austria), Thales (France)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2015073532

FWCI: 2.036

Cites: 8

Cited by: 5

Related to: 10