Author

M. Mataln

Observed institution: Materials Center Leoben (Austria)

OpenAlex ID: A5030355447

Exploring the thermal limit of GaN power devices under extreme overload conditions

2017 · F.P. Pribahsnik, M. Nelhiebel, et al. · Microelectronics Reliability · 10

Multi-physics simulation of the component attachment within embedding process

2013 · K. Macurova, A. Kharicha, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 5

Piezoelectric properties of GaN-on-Si heterostructures and their implications on lifetime during switching operation

2020 · F. P. Pribahsnik, M. Bernardoni, et al. · IEEE Transactions on Power Electronics · 3

Combined experimental and numerical approach to study electro-mechanical resonant phenomena in GaN-on-Si heterostructures

2018 · F.P. Pribahsnik, M. Bernardoni, et al. · Microelectronics Reliability · 1

Works count: 4

Citation count: 19

H-index: 3

I10-index: 1