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Hong Wan Ng
Observed names:
Hong Wan NG,
Hong wan Ng,
Hongwan Ng
Institution:
Micron (Singapore)
Observed institution:
Micron (Singapore)
ORCID:
0009-0000-3633-7105
Observed ORCID:
0009-0000-3633-7105
OpenAlex ID:
A5054169518
Study on Package Strength of uMCP (Multichip Package) for Mobile Application through Three-Point Bending Test and Simulation
2020
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
17
Integration of Artificial Neural Network and Finite Element Simulation for Package Warpage Prediction
2023
·
Sunil Kumar Panigrahy
, Fa Xing Che
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
11
Development on Fatigue Life Model of Lead-Free Solder for First Failure Prediction
2022
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
11
Deep Learning Study on Memory IC Package Warpage Using Deep Neural Network and Finite Element Simulation
2025
·
Sunil Kumar Panigrahy
, Fa Xing Che
, et al.
·
Chips
·
9
PDF
Substrate Copper Trace Crack Characterization and Simulation
2023
·
Wei Yu
, Faxing Che
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Partial Underfill Impact Study on Solder Joint Reliability in Smartphone Application
2022
·
Ling Pan
, Fa Xing Che
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
8
Investigation on memory package crack and prevention under temperature cycling test
2024
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
Materials Science in Semiconductor Processing
·
6
Physics-driven Regression Algorithm on Solder Joint Fatigue Life Prediction for Mobile SiP Packages
2023
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Study on Substrate Crack through Experiment and Simulation on SSD BGA under Temperature Cycling
2022
·
Wei Yu
, Faxing Che
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
6
Package Warpage Modeling by Considering Shrinkage Behavior of EMC and Substrate
2021
·
Wei Yu
, Pluck Shin-Yueh Yang
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
6
Design Optimization to Boost Solder Joint Reliability Performance for SSD BGA Package
2023
·
Ling Pan
, Fa Xing Che
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Methodology of Artificial Intelligence Aided Hybrid Modeling for Predicting Solder Joint Reliability of BGA Package
2023
·
Ling Pan
, Faxing Che
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
4
Study on Solder Joint Shape Impact on Board Level Reliability for Managed NAND Mobile Package
2022
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
4
Investigation on Underfill Properties Effect on Board Level Solder Joint Reliability for SiP Package
2023
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
Effect of Printed Circuit Board Design Parameters on Solder Joint Reliability for Memory Packages
2022
·
Koustav Sinha
, Christopher Glancey
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
3
An Overview of Substrate Copper Trace Crack Through Experiments, Characterization, and Numerical Simulations
2025
·
Wei Yu
, Faxing Che
, et al.
·
Micromachines
·
2
Significance of Die Shadow Size and Placement on Solder Joint Reliability Performance
2024
·
Bhaskar Rao Korpati
, Prasad N V Nune
, et al.
·
IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
·
2
Effect of Underfill on Substrate Trace Crack under PTC
2023
·
Wei Yu
, Ling Pan
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
2
Enhancing Predictive Accuracy of Warpage and Reliability for Advanced Packages by Modelling Accurate Poisson's Ratio in Finite Element Analysis
2025
·
Fa Xing CHE
, Vance LIU
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Advanced Prediction Model for SACQ Solder Reliability Assessment for Automotive Memory Applications
2024
·
Ling Pan
, Fa Xing Che
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
·
1
Key Insights into Design for Reliability of 3D NAND Packages in Solid-State Drive
2025
·
Ling Pan
, Faxing Che
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Linear Regression Model development for Package Warpage
2024
·
Sunil Kumar Panigrahy
, Fa Xing Che
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Parametric study of factors effecting PMIC-QFN reliability under temperature cycling in DIMM systems
2024
·
Nagavenkata Varaprasad Nune
, Christopher Glancey
, et al.
·
IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)
Impact of Package Warpage on Package Strength Assessment Under Three-Point Bending Test
2024
·
Fa Xing Che
, Yeow Chon Ong
, et al.
·
IEEE Electronics Packaging Technology Conference (EPTC)
Leakage current based Thermal Design Approach for SSD Reliability
2024
·
Ramesh Nallavelli
, Prasad N V Nune
, et al.
·
IEEE Electron Devices Technology & Manufacturing Conference (EDTM)
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Works count:
29
Citation count:
115
H-index:
6
I10-index:
3
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