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Martin Ihle

Observed names: Ihle, M., Ihle, Martin, M. Ihle
ORCID: 0000-0002-3964-2954
Observed ORCID: 0000-0002-3964-2954
OpenAlex ID: A5054361362
Functional Printing of MMIC-Interconnects on LTCC Packages for sub-THz applications
2019 · Martin Ihle, Steffen Ziesche, et al. · European Microelectronics and Packaging Conference · 16
Compact LTCC Packaging and Printing Technologies for Sub–THz Modules
2018 · Martin Ihle, Steffen Ziesche, et al. · Electronic System-Integration Technology Conference (ESTC) · 16
Hybrid gold-silica nanoparticles for plasmonic applications: A comparison study of synthesis methods for increasing gold coverage
2023 · Romain Trihan, Oskar Bogucki, et al. · Heliyon · 11
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Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
2012 · Martin Ihle, Uwe Partsch, et al. · Journal of Microelectronics and Electronic Packaging · 10
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Inkjet-printed low temperature co-fired ceramics: process development for customized LTCC
2024 · Jonas Jäger, Martin Ihle, et al. · Flexible and Printed Electronics · 7
Aerosol Jet Printing of Two Component Thick Film Resistors on LTCC
2013 · K. Swiecinski, M. Ihle, et al. · Journal of Microelectronics and Electronic Packaging · 7
Aerosol Printing of High Resolution Films for LTCC-Multilayer Components
2012 · Martin Ihle, Uwe Partsch, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 7
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A broadband 140 GHz aperture-coupled SPA Antenna in LTCC-Technology
2023 · Martin Ihle, Steffen Ziesche, et al. · European Microwave Conference (EuMC) · 6
Characterization of anodic bondable LTCC for wafer-level packaging
2016 · Xiaodong Hu, Manuel Bauscher, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Millimeter Wave Retrodirective Van Atta Arrays in LTCC Technology
2024 · Kamil Trzebiatowski, Martin Ihle, et al. · European Conference on Antennas and Propagation · 5
Aerosol printed conductors for miniaturized LTCC packaging
2010 · U. Partsch, S. Mosch, et al. · Electronic System-Integration Technology Conference (ESTC) · 5
Low temperature co-fired ceramics technology for active eddy current turbocharger speed sensors
2018 · Martin Ihle, Steffen Ziesche, et al. · Microelectronics International · 4
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300°C
2022 · Holger Kappert, Sebastian Braun, et al. · Journal of Microelectronics and Electronic Packaging · 3
Novel High-g Accelerometer Geometry Requiring 90 Degree Contacting Techniques
2012 · Robert Kuells, Siegfried Nau, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 3
A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300 °C
2021 · Holger Kappert, Sebastian Braun, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
HOT-300 – A Multidisciplinary Technology Approach Targeting Microelectronic Systems at 300 °C Operating Temperature
2016 · Holger Vogt, Frank Altmann, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
Development of a robust, ceramic MEMS-package for hermetically sealed and highly shock-resistant SMD-devices
2014 · Adrian Goldberg, Martin Ihle, et al. · Electronic System-Integration Technology Conference (ESTC) · 2
Aerosol jet printing of two component thick film resistors on LTCC
2013 · K. Swiecinski, M. Ihle, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2
Novel Technology Options for Multilayer-Based Ceramic Microsystems
2011 · Uwe Partsch, Adrian Goldberg, et al. · Journal of Microelectronics and Electronic Packaging · 2
Towards highly conductive silver pastes for LTCC power electronics
2011 · Markus Eberstein, Christel Kretzschmar, et al. · IMAPSource Proceedings · 2
Naked-Eye Detection of Water Contaminants Enabled by Engineered Plasmonic Resonance in Hybrid Detector Systems
2025 · Bartosz Janaszek, Marcin Kieliszczyk, et al. · Applied Sciences · 1
LTCC - packaging of a laser optical system for harsh environments
2016 · Martin Ihle, Steffen Ziesche, et al. · Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS · 1
Ceramic substrate technology for wafer level packaging of MEMS
2016 · Steffen Ziesche, Martin Ihle, et al. · International Spring Seminar on Electronics Technology · 1
Materials and technologies to enable high temperature stable MEMS and electronics for smart systems used in harsh environments
2016 · F. Gabler, F. Roscher, et al. · China Semiconductor Technology International Conference (CSTIC) · 1
Aerosol-printed horn-shaped antenna on LTCC
2013 · Balcells-Ventura, J., Leiss, J., et al. · Publikationsdatenbank der Fraunhofer-Gesellschaft (Fraunhofer-Gesellschaft) · 1
Works count: 45
Citation count: 127
H-index: 7
I10-index: 4
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