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Hirokazu Noma
Observed names:
H. Noma,
Hirokazu NOMA,
Noma Hirokazu,
Noma, Hirokazu
Institution:
Resonac (Japan)
Observed institutions:
IBM (United States),
Waseda University,
Showa Denko (Japan),
IBM Research - Tokyo,
Resonac (Japan),
Showa Denko Materials Co., Ltd. (Japan),
IBM Japan, Ltd. (Japan),
Hitachi (Japan),
The University of Tokyo
show all 9
ORCID:
0000-0002-3196-3120
Observed ORCID:
0000-0002-3196-3120
OpenAlex ID:
A5055358102
IMC bonding for 3D interconnection
2010
·
K. Sakuma
, K. Sueoka
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
65
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
2009
·
Yasumitsu Orii
, Kazushige Toriyama
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
46
Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
2011
·
K. Sakuma
, K. Toriyama
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
31
Micro Structure Observation and Reliability Behavior of Peripheral Flip Chip Interconnections with Solder-Capped Cu Pillar Bumps
2011
·
Yasumitsu Orii
, Kazushige Toriyama
, et al.
·
Transactions of The Japan Institute of Electronics Packaging
·
26
PDF
Injection molded solder - A new fine pitch substrate bumping method
2009
·
Jae-Woong Nah
, Peter A. Gruber
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
21
Electromigration analysis of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
2011
·
Yasumitsu Orii
, Kazushige Toriyama
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
16
High-Bandwidth Density and Low-Power Optical MCM Using Waveguide-Integrated Organic Substrate
2014
·
Masao Tokunari
, Hsiang-Han Hsu
, et al.
·
Journal of Lightwave Technology
·
15
Compensation of Surface Roughness Using an Au Intermediate Layer in a Cu Direct Bonding Process
2018
·
Hirokazu Noma
, Takumi Kamibayashi
, et al.
·
Journal of Electronic Materials
·
13
Uniaxial and biaxial strain field dependence of the thermal oxidation rate of silicon
2001
·
Hirokazu Noma
, Hiroyuki Takahashi
, et al.
·
Journal of Applied Physics
·
11
High-bandwidth density optical I/O for high-speed logic chip on waveguide-integrated organic carrier
2011
·
Masao Tokunari
, Yutaka Tsukada
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
10
Fine Copper Lines with High Adhesion on High Rigidity Dielectrics
2022
·
Masataka Nishida
, Hirokazu Noma
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Development of Liquid Compression Molding (LCM) Material for Low Warpage
2017
·
Tsuyoshi Kamimura
, Satomi Kawamoto
, et al.
·
IMAPSource Proceedings
·
9
Warpage study of FO-WLP build up by material properties and process
2016
·
Kouji Hamaguchi
, Hirokazu Noma
, et al.
·
Electronic System-Integration Technology Conference (ESTC)
·
9
Large Panel Level Fan Out Package Built up Study with Film Type Encapsulation Material
2016
·
Hiroshi Takahashi
, Hirokazu Noma
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
9
Optimization of Core Material Properties for Large Flip-chip Ball Grid Array Substrate to Manage Both Warpage and Board Level Reliability
2024
·
Hirokazu Noma
, Masaki Takahashi
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
8
Effects of Low CTE Materials on Thermal Deformation of Organic Substrates in Flip Chip Package Application
2015
·
Hiroyuki Mori
, Sayuri Kohara
, et al.
·
ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
·
8
HAST failure investigation on ultra-high density lines for 2.1D packages
2015
·
Hirokazu Noma
, Keishi Okamoto
, et al.
·
International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
·
8
Effect of preformed IMC Layer on Electromigration of Solder Capped Cu Pillar Bump Interconnection on an organic substrate
2012
·
Yasumitsu Orii
, Kazushige Toriyama
, et al.
·
IMAPSource Proceedings
·
7
Chip/Package Design and Technology Trade-offs in the 65nm Cell Broadband Engine
2007
·
P. Harvey
, Y. Zhou
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
7
Expanding Film and Process for High Efficiency 5 Sides Protection and FO-WLP Fabrication
2017
·
Kazutaka Honda
, Naoya Suzuki
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
6
Warpage analysis of organic substrates for 2.1D packaging
2015
·
Sayuri Kohara
, Keishi Okamoto
, et al.
·
IEEE International D Systems Integration Conference
·
6
Effect of preformed IMC layer on electromigration of peripheral ultra fine pitch C2 flip chip interconnection with solder capped Cu pillar bump
2011
·
Yasumitsu Orii
, Kazushige Toriyama
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
6
Investigations of fluxless flip-chip bonding using vacuum ultraviolet and formic acid vapor surface treatment
2011
·
N. Unami
, H. Noma
, et al.
·
International Symposium on Advanced Packaging Materials
·
5
Wettability and Reliability for Double-Sided Assembly with Chip Connection (C2) Flip-Chip Technology
2009
·
Hirokazu Noma
, Yukifumi Oyama
, et al.
·
Transactions of The Japan Institute of Electronics Packaging
·
5
PDF
Packaging the Cell Broadband Engine microprocessor for supercomputer applications
2008
·
P. Harvey
, R. Mandrekar
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
5
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Works count:
49
Citation count:
394
H-index:
10
I10-index:
10
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