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Author

Anass Jakani

Observed names: A. Jakani, Jakani, Anass
Institution: III V Lab
ORCID: 0000-0002-6585-5398
Observed ORCID: 0000-0002-6585-5398
OpenAlex ID: A5055468588
Comparison of GaN HEMTs Thermal Results through different measurements methodologies: Validation with 3D simulation
2021 · Anass Jakani, Raphael Sommet, et al. · International Workshop on Thermal Investigations of ICs and Systems · 15
Thermal Simulation and Characterization of GaN HEMT using Gate Resistance Thermometry and Thermoreflectance imaging
2022 · K. Karrame, A. Jakani, et al. · IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization · 13
Understanding the Thermal Time Constants of GaN HEMTs through Model Order Reduction Technique
2021 · Anass Jakani, Raphael Sommet, et al. · Electronics · 11
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Transient thermal simulation of a SiP FO-WLP embedding a GaN power amplifier
2024 · N’Doua Luc Arnaud Kakou, Raphael Sommet, et al. · International Workshop on Thermal Investigations of ICs and Systems · 5
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GaN HEMTs thermal time constants: Theory and Measurements
2022 · Anass Jakani, Raphael Sommet, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 4
Dual Approach for the characterization of the thermal impedance using 3omega and thermoreflectance methods
2020 · Anass Jakani, Raphael Sommet, et al. · International Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits (INMMiC) · 2
Investigation of V-Band GaN MMIC Integration in an Advanced FO-WLP Package
2025 · M. Bouslama, S. Piotrowicz, et al. · IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS) · 1
V-Band InAlN/GaN/SiC MMIC Amplifier Embedded by Fan Out Wafer Level Packaging Technology
2025 · S. Piotrowicz, M. Bouslama, et al. · European Microwave Integrated Circuits Conference · 1
Transient Thermal Response in AlGaN/GaN HEMT Transistor: Influence of Dissipated Power on Thermal Time Constants
2026 · Jakani, Anass, Jacquet, Jean-Claude, et al. · HAL
Investigation sur l'extraction de la résistance thermique des GaN-HEMT par la méthode de mesure I-DLTS
2026 · Jakani, Anass, Jacquet, Jean-Claude, et al. · HAL
Thermal Analysis of a 5G Telecom Demonstrator in FO-WLP SiP with Integrated Gan Power Amplifier and GaAs Low Noise Amplifier
2025 · Anass Jakani, Jean-Claude Jacquet, et al. · International Workshop on Thermal Investigations of ICs and Systems
Multi-Scale and Multi-Physics Analysis of a GaN System in Package Using Fan Out Wafer Level Packaging (FO-WLP) Technology
2025 · N'Doua Luc Arnaud Kakou, José Anderson Silva dos Santos, et al. · International Workshop on Thermal Investigations of ICs and Systems
Thermal Management Investigation of a V-Band GaN Amplifier Embedded Into an Advanced Package
2025 · Mohamed Bouslama, Anass Jakani, et al. · International Workshop on Thermal Investigations of ICs and Systems
Développement d’un banc de mesure par thermoreflectance pour les composants de puissance
2022 · Anass Jakani · theses.fr (ABES)
Mesure de température par une méthode de thermoréflectance multispectrale
2022 · Lozachmeur, Samuel, Jakani, Anass, et al. · HAL
La thermique des transistors GaN en régime transitoire : Théorie et mesures
2022 · Jakani, Anass, Karrame, Khalil, et al. · HAL
Mesure temporelle de la température des dispositifs micro-ondes par thermoréflectance
2022 · Jakani, Anass, Karrame, Khallil, et al. · HAL
Thermal characterization of AlGaN/GaN HEMT using thermoreflectance method
2020 · Sommet, Raphaël, Jakani, Anass, et al. · HAL
Works count: 20
Citation count: 52
H-index: 4
I10-index: 3
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