Author

John Hunt

Observed name: J.R. Hunt

Institution: Advanced Semiconductor Engineering (Taiwan)

Observed institution: Advanced Semiconductor Engineering (Taiwan)

OpenAlex ID: A5057819399

Chemically Milled VHF and UHF AT-Cut Resonators

1985 · J.R. Hunt, R.C. Smythe · Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS) · 48

Synergy between 2.5/3D development and hybrid 3D Wafer Level Fanout

2012 · John Hunt, Y. C. Ding, et al. · Electronic System-Integration Technology Conference (ESTC) · 9

Reliability improvements for advanced Wafer Level packaging

2010 · John Hunt, Danial Huang, et al. · Electronic System-Integration Technology Conference (ESTC) · 5

Reliability investigations of large die wafer level packages: Optimization of package structure and materials to improve board level reliability

2014 · Markus Jarn, Chueh-An Hsieh, et al. · Electronic System-Integration Technology Conference (ESTC) · 4

Backend processing for wafer level chip scale packaging

2004 · J.R. Hunt · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 4

Low Cost Chip Last Fanout Package using Coreless Substrate

2015 · Scott Chen, Simon Wang, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT) · 2

WLCSP Materials: Science and Alchemy

2006 · J.R. Hunt, W.T. Chen · International Symposium on Advanced Packaging Materials · 2

Chemically-Milled VHF 6 UHF Quartz Resonators 6 Monolithic Filters

1985 · R.C. Smythe, J.R. Hunt, et al. · Proceedings/Proceedings - IEEE Ultrasonics Symposium · 2

Reliability investigations of large die wafer level package (part II): Impact of solder ball composition, die thickness, and polymer passivition on board level reliability

2016 · Chien-An Hsieh, Markus Jarn, et al. · Electronic System-Integration Technology Conference (ESTC) · 1

Chip Last Fan Out as an Alternative to Chip First

2015 · Scott Chen, Simon Wang, et al. · IMAPSource Proceedings · 1

Evolutionary development of Wafer Level Packaging

2010 · John Hunt · IEEE/CPMT International Electronics Manufacturing Technology Symposium · 1

Using Deca’s Adaptive PatterningTM to Win the Chiplet Integration Race with Siemens EDA and ASE

2024 · Robin Gabriel, Jan Kellar, et al. · IMAPSource Proceedings

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Evaluation of Polymer Core Solderballs for Wafer Level Reliability Improvements

2014 · John Hunt, Adren Hsieh, et al. · Additional Conferences (Device Packaging HiTEC HiTEN & CICMT)

Works count: 13

Citation count: 79

H-index: 4

I10-index: 1