Get started
Author

John Persic

Observed name: J. Persic
OpenAlex ID: A5060133286
Palladium Nanoparticles Loaded on Carbon Modified TiO2 Nanobelts for Enhanced Methanol Electrooxidation
2013 · Robert Liang, Anming Hu, et al. · Nano-Micro Letters · 75
PDF
Thermal stability and reaction properties of passivated Al/CuO nano-thermite
2011 · Jeff Wang, Anming Hu, et al. · Journal of Physics and Chemistry of Solids · 64
Characterization of thermochemical properties of Al nanoparticle and NiO nanowire composites
2013 · John Z Wen, Sophie Ringuette, et al. · Nanoscale Research Letters · 41
PDF
Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force
2009 · C.J. Hang, W.H. Song, et al. · Microelectronic Engineering · 40
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
2010 · A. Shah, A. Rezvani, et al. · Microelectronics Reliability · 32
Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding
2009 · A. Pequegnat, C. J. Hang, et al. · Journal of Materials Science Materials in Electronics · 29
PEDOT:PSS nano-gels for highly electrically conductive silver/epoxy composite adhesives
2017 · Pengxiang Si, Josh Trinidad, et al. · Journal of Materials Science Materials in Electronics · 28
Effect of gas type and flow rate on Cu free air ball formation in thermosonic wire bonding
2010 · A. Pequegnat, H.J. Kim, et al. · Microelectronics Reliability · 28
Molecular dynamics simulation of energetic aluminum/palladium core–shell nanoparticles
2010 · Ngoc Ha Nguyen, Anming Hu, et al. · Chemical Physics Letters · 27
Low cost Pd coated Ag bonding wire for high quality FAB in air
2012 · Suresh Tanna, Jairus L. Pisigan, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 26
A Review of Silver Wire Bonding Techniques
2023 · Bin An, Hongliang Zhou, et al. · Micromachines · 23
PDF
Thermo-chemical characterization of a Al nanoparticle and NiO nanowire composite modified by Cu powder
2013 · Golnaz Bohlouli-Zanjani, John Z. Wen, et al. · Thermochimica Acta · 23
Measuring stress next to Au ball bond during high temperature aging
2009 · M. Mayer, J.T. Moon, et al. · Microelectronics Reliability · 17
Explaining Nondestructive Bond Stress Data From High-Temperature Testing of Au-Al Wire Bonds
2013 · Michael James McCracken, Yusuke Koda, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 15
Effects of Bonding Parameters on Free Air Ball Properties and Bonded Strength of Ag-10Au-3.6Pd Alloy Bonding Wire
2020 · Jun Cao, Junchao Zhang, et al. · Micromachines · 14
PDF
Assessing Au-Al wire bond reliability using integrated stress sensors
2010 · Michael J. McCracken, Hyoung Joon Kim, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 13
Microelectronic Wire Bonding with Insulated Au Wire: Effects of Process Parameters on Insulation Removal and Crescent Bonding
2008 · Jaesik Lee, Michael Mayer, et al. · MATERIALS TRANSACTIONS · 13
PDF
Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
2009 · A. Shah, M. Mayer, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 11
Comparison of Insulated with Bare Au Bonding Wire: HAZ Length, HAZ Breaking Force, and FAB Deformability
2009 · Wan Ho Song, Chunjin Hang, et al. · Journal of Electronic Materials · 10
Simulation study on the effect of palladium layer thickness and temperature on the bonding properties of palladium coated copper wire
2024 · Bin An, Hongliang Zhou, et al. · Microelectronics Reliability · 8
Palladium Nanoparticles Loaded on Carbon Modified TiO2 Nanobelts for Enhanced Methanol Electrooxidation
2013 · Robert Liang, Anming Hu, et al. · Nano-Micro Letters · 8
PDF
Symmetric miniaturized heating system for active microelectronic devices
2010 · Michael McCracken, Michael Mayer, et al. · Review of Scientific Instruments · 7
Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding
2010 · Yan Huang, A. Shah, et al. · IEEE Transactions on Ultrasonics Ferroelectrics and Frequency Control · 7
Pull Force and Tail Breaking Force Optimization of the Crescent Bonding Process with Insulated Au Wire
2007 · J. Lee, M. Mayer, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 7
Experimental study on spheroidal morphology of palladium coated copper wire with different palladium layer thickness
2024 · Bin An, Hongliang Zhou, et al. · APL Materials · 6
Works count: 45
Citation count: 599
H-index: 14
I10-index: 19
Year
Topic
Type