Author

Yeh-Ning Jou

1996 · Ming-Jer Chen, Jih-Shin Ho, et al. · IEEE Transactions on Electron Devices · 44
2009 · Wen-Yi Chen, Ming-Dou Ker, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 27
2022 · Jian-Hsing Lee, Yeh-Jen Huang, et al. · IEEE International Reliability Physics Symposium proceedings · 19
2008 · Wen-Yi Chen, Ming-Dou Ker, et al. · IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) · 15
2009 · Wen-Yi Chen, Ming-Dou Ker, et al. · IEEE International Symposium on Circuits and Systems proceedings · 12
2023 · Jian-Hsing Lee, Ching-Ho Li, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 9
2024 · Jian-Hsing Lee, Yeh-Jen Huang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 7
2019 · Shao-Chang Huang, Jian-Hsing Lee, et al. · Annual EOS/ESD Symposium (EOS/ESD) · 6
2018 · Chia-Tsen Dai, Ming-Dou Ker, et al. · Electrical Overstress/Electrostatic Discharge Symposium · 6
2023 · Jian-Hsing Lee, Ching-Ho Li, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 5
2015 · Kai-Neng Tang, Seian-Feng Liao, et al. · Asia-Pacific International Symposium on Electromagnetic Compatibility (APEMC) · 5
2010 · Aloysius Priartanto Herlambang, Gene Sheu, et al. · IEEE Region 10 Conference (TENCON) · 5
2002 · Ming-Jer Chen, Chin-Shan Hou, et al. · IEEE International Reliability Physics Symposium proceedings · 5
2019 · Shao-Chang Huang, Hsien-Feng Liao, et al. · IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) · 4
2022 · Jian-Hsing Lee, Chih-Hsuan Lin, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 3
2025 · Jian-Hsing Lee, Yeh-Jen Huang, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
2024 · Chih-Cherng Liao, Ching-Ho Li, et al. · IEEE Transactions on Device and Materials Reliability · 2
2024 · Jian-Hsing Lee, Chih-Cherng Liao, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
2022 · Shao-Chang Huang, Jian-Hsing Lee, et al. · IEEE International Conference on Consumer Electronics - Taiwan (ICCE-Taiwan) · 2
2020 · Ming-Chun Chen, Ming-Dou Ker, et al. · IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) · 2
2015 · Yi-Jie Huang, Ming-Dou Ker, et al. · IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference · 2
2006 · Sheng-fu Hsu, Ming-dou Ker, et al. · IEEE International Reliability Physics Symposium proceedings · 2
2015 · Seian-Feng Liao, Kai-Neng Tang, et al. · European Conference on Circuit Theory and Design · 1
1998 · Ming-Jer Chen, Hun-Shung Lee, et al. · IEEE Electron Device Letters · 1
Works count: 33
Citation count: 195
H-index: 7
I10-index: 5
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