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Author

Hang Shan Choy

Observed names: H S Choy, H. Choy, H. S. Choy, H.S. Choy, Hang-Shan Choy
ORCID: 0000-0001-6596-4669
Observed ORCID: 0000-0001-6596-4669
OpenAlex ID: A5064130949
Laser polishing of additive manufactured CoCr alloy components with complex surface geometry
2018 · K.C. Yung, T.Y. Xiao, et al. · Journal of Materials Processing Technology · 134
Effects of laser polishing on surface microstructure and corrosion resistance of additive manufactured CoCr alloys
2018 · W.J. Wang, K.C. Yung, et al. · Applied Surface Science · 105
Thermal performance of high brightness LED array package on PCB
2010 · K.C. Yung, H. Liem, et al. · International Communications in Heat and Mass Transfer · 94
Ink-jet printing and camera flash sintering of silver tracks on different substrates
2010 · K.C. Yung, X. Gu, et al. · Journal of Materials Processing Technology · 86
Superior thermal conductivity of polymer nanocomposites by using graphene and boron nitride as fillers
2013 · H. Liem, H.S. Choy · Solid State Communications · 79
Enhanced redshift of the optical band gap in Sn-doped ZnO free standing films using the sol–gel method
2009 · K C Yung, H Liem, et al. · Journal of Physics D Applied Physics · 79
Laser polishing of additive manufactured tool steel components using pulsed or continuous-wave lasers
2019 · K. C. Yung, S. S. Zhang, et al. · The International Journal of Advanced Manufacturing Technology · 71
Laser polishing of additive manufactured CoCr components for controlling their wettability characteristics
2018 · K.C. Yung, W.J. Wang, et al. · Surface and Coatings Technology · 60
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Laser direct patterning of a reduced-graphene oxide transparent circuit on a graphene oxide thin film
2013 · K. C. Yung, H. Liem, et al. · Journal of Applied Physics · 53
Thermal investigation of a high brightness LED array package assembly for various placement algorithms
2013 · K.C. Yung, H. Liem, et al. · Applied Thermal Engineering · 49
Heat transfer analysis of a high-brightness LED array on PCB under different placement configurations
2014 · K.C. Yung, H. Liem, et al. · International Communications in Heat and Mass Transfer · 39
Additive and Photochemical Manufacturing of Copper
2016 · Winco K. C. Yung, Bo Sun, et al. · Scientific Reports · 36
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Eye-friendly reduced graphene oxide circuits with nonlinear optical transparency on flexible poly(ethylene terephthalate) substrates
2015 · Winco K. C. Yung, Guijun Li, et al. · Journal of Materials Chemistry C · 30
Degradation mechanism beyond device self-heating in high power light-emitting diodes
2011 · K. C. Yung, H. Liem, et al. · Journal of Applied Physics · 23
Photochemical Copper Coating on 3D Printed Thermoplastics
2016 · Winco K. C. Yung, Bo Sun, et al. · Scientific Reports · 22
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Heat dissipation performance of a high-brightness LED package assembly using high-thermal conductivity filler
2013 · K. C. Yung, H. Liem, et al. · Applied Optics · 18
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Prerequisite for maximizing thermal conductivity of epoxy laminate using filler
2012 · K. C. Yung, H. Liem, et al. · Journal of Materials Science Materials in Electronics · 15
Development of high thermal conductivity via BNNTs/epoxy/organic-Si hybrid composite systems
2016 · K. C. Yung, T. Xu, et al. · Journal of Materials Science Materials in Electronics · 14
Multiresponse Optimization of Surface Plasma Treatment Using Taguchi Method
2010 · K. C. Yung, H. Liem, et al. · Materials and Manufacturing Processes · 11
High-performance InP/Ga0.47In0.53As/InP metal-semiconductor-metal photodetectors with a strained Al0.1In0.9P barrier enhancement layer
1995 · P. T. Chan, H. S. Choy, et al. · Applied Physics Letters · 11
Evolution of Microstructure, Texture and Mechanical Properties for Multilayered Al Matrix Composites by Accumulative Roll Bonding
2021 · Wen-Jing Wang, Kam-Chuen Yung, et al. · Materials · 10
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Impact of plasma etching on fabrication technology of liquid crystal polymer printed circuit board
2009 · K. C. Yung, H. Liem, et al. · Journal of Materials Science Materials in Electronics · 10
UV laser cutting of beech plywood
2020 · Kam Chuen Yung, Hang Shan Choy, et al. · The International Journal of Advanced Manufacturing Technology · 9
Thermal Investigation and Placement Design of High-Brightness LED Array Package on PCB for Uniform Illuminance
2011 · K. C. Yung, H. Liem, et al. · Journal of Electronic Packaging · 8
A prerequisite to achieving high performance polymer/inorganic thin film diodes
2010 · H. Liem, H.S. Choy, et al. · Solid State Communications · 7
Works count: 33
Citation count: 1,089
H-index: 16
I10-index: 22
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