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Quanbin Yao

Effects of silicon via profile on passivation and metallization in TSV interposers for 2.5D integration
2015 · P.R. Lin, G.Q. Zhang, et al. · Microelectronic Engineering · 20
Electrical simulation of gold bonding wire with different parameters
2015 · Dejing Wang, Yuanfu Zhao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 14
Overview of Au-Al Bond Interface
2021 · Shuang Xie, Pengrong Lin, et al. · International Conference on Electronics, Circuits and Information Engineering (ECIE) · 8
Submodelling method for modelling and simulation of high-density electronic assemblies
2020 · Lingsong Kong, Quanbin Yao, et al. · Journal of Physics Conference Series · 7
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Overview of the assembly and packaging of wide band gap semiconductor technologies
2017 · Wenzhong Zhao, Quanbin Yao · International Conference on Electronic Packaging Technology (ICEPT) · 7
Effect of temperature cycling on reliability of flip chip solder joint
2014 · Xueming Jiang, Pengrong Lin, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 7
Interface mechanical behavior of gold alloy wire bonding
2021 · Shuang Xie, Pengrong Lin, et al. · Journal of Physics Conference Series · 5
Transient liquid phase bonding of Sn-Pb solder with added Cu particles
2024 · Jiaxing Wang, Pengrong Lin, et al. · Journal of Physics Conference Series · 4
The influence of the solder joint void on the CCGA package reliability
2014 · Yingzhuo Huang, Binhao Lian, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Reliability study of the solder joints in CCGA package during thermal test
2014 · Xiaorui Lv, Yingzhuo Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Simulation of bonding wire deformation in random vibration
2013 · Peifeng Hu, Yusheng Cao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Electrical simulation research for IC package gold bonding wire
2010 · Cao Yusheng, Du Shuan, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 3
Research on Thermal Resistance Test Method of Stacked Package Based on High-precision Controllable Thermal Test Chip
2022 · Cai Jiawei, Lv Xiaorui, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Transient liquid phase bonding of Sn-Pb solder with added Ni particles
2022 · Jiaxing Wang, Quanbin Yao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
The reliability of high-lead solder joints in flip-chip devices
2014 · Lingjuan Tian, Yuanfu Zhao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Flip chip CBGA package design and simulation
2013 · Xie Wenjun, Cao Yusheng, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 2
Effect of chip size on thermal fatigue of flip-chip bump
2018 · Zhao Wenzhong, Yao Quanbin, et al. · International Conference on Electronics Technology (ICET) · 1
The finite element analysis on reliability of gold bump
2016 · Jiansong Liu, Quanbin Yao, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Study on Electrical Performance of FC and WB in IC Ceramic Package
2016 · Dejing Wang, Yuanfu Zhao, et al. · International Conference on Materials Engineering, Manufacturing Technology and Control (ICMEMTC) · 1
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Effect of Cu on interfacial reaction in high-lead solder bumps
2015 · Liwei Xu, Mingliang Huang, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Study of the junction to case thermal resistance test method for IC based on ETM
2013 · Zhang Hongshuo, Zhao Yuanfu, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 1
Study on no IMC Solid state bonding method for high-density 2.5D/3D integration
2024 · Zongyang Li, Zhibo Qu, et al. · Journal of Physics Conference Series
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Study on mechanical properties and microstructure reliability of composite solder under multiple reflow and high-temperature storage
2023 · Jiaxing Wang, Long Zhang, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Effect of insulating material and structure on the reliability of silicon through hole under thermal stress
2023 · Zongyang Li, Quanbin Yao, et al. · International Conference on Electronic Packaging Technology (ICEPT)
Simulation analysis of a specification package for high density and high voltage power module
2022 · Jiawei Cai, Long Zhang, et al. · Journal of Physics Conference Series
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Works count: 37
Citation count: 100
H-index: 6
I10-index: 2
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