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Ying-Chih Lee

Fan-Out Chip on Substrate Device Interconnection Reliability Analysis
2017 · Ying-Chih Lee, Wei-Hong Lai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 38
Finite element model verification for packaged printed circuit board by experimental modal analysis
2008 · Ying-Chih Lee, Bor-Tsuen Wang, et al. · Microelectronics Reliability · 28
Solder joint reliability analysis for large size WLCSP
2017 · Meng-Kai Shih, Hsin-Chih Shih, et al. · International Conference on Electronics Packaging (ICEP) · 12
Parameters study of thermomechanical reliability of board-level fan-out package
2017 · Meng-Kai Shih, Ying-Chih Lee, et al. · International Conference on Electronics Packaging (ICEP) · 7
Comparative Study on Mechanical and Thermal Performance of eWLB, M-Series™ and Fan-Out Chip Last Packages
2018 · Meng-Kai Shih, Eddie Tsai, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 6
Deformation prediction of 2.5D IC package
2016 · Ian Hu, Ming-Han Wang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 6
Electrical, thermal and warpage investigation on high bandwidth PoP
2013 · Mike Hung, Chang-Chi Lee, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 6
Vibration and bondability analysis of fine-pitch Cu wire bonding
2011 · Chang-Lin Yen, Ying-Chih Lee, et al. · International Conference on Electronic Packaging Technology (ICEPT) · 4
Response prediction and verification for PCB with package due to thermal and random vibration coupling effects
2009 · Bor-Tsuen Wang, Fu-Xiang Hsu, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 4
Large size WLCSP analysis on temperature cycling reliability test
2016 · Hsin-Chih Shih, Ying-Chih Lee, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 2
3D WL MEMS with Various TSV Technologies' Thermo-Mechanical Analysis
2016 · Ying-Te Ou, Hung-Hsiang Cheng, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 2
Calibration of Equivalent Finite Element Model for Packaged Printed Circuit Board by Experimental Modal Analysis
2008 · Ying-Chih Lee, Bor-Tsuen Wang, et al. · IEEE Electronics Packaging Technology Conference (EPTC) · 2
A refined finite element model verification for IC packaged PCB with thermal effects
2010 · Bor-Tsuen Wang, Xiu-Wei Liang, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference · 1
3D WL MEMS with TSV last technology's mechanical analysis
2017 · Hsiao-Yen Lee, Chin-Cheng Kuo, et al. · International Conference on Solid-State Sensors, Actuators and Microsystems
Spectrum response analysis for PCB with heating ICs in different heating conditions
2011 · Bor-Tsuen Wang, Yau-Chang Lee, et al. · International Microsystems, Packaging, Assembly and Circuits Technology Conference
Works count: 15
Citation count: 118
H-index: 6
I10-index: 3
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