Work

A refined finite element model verification for IC packaged PCB with thermal effects

Year: 2010

Type: conference-paper

Source: International Microsystems, Packaging, Assembly and Circuits Technology Conference

DOI: 10.1109/impact.2010.5699645

Authors: Bor-Tsuen Wang, Xiu-Wei Liang, Fu-Xiang Hsu, Yi-Shao Lai, Chang-Lin Yeh, Ying-Chih Lee

Institutions: National Pingtung University of Science and Technology, Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Structural Health Monitoring Techniques

Subfield: Civil and Structural Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W1982933039

FWCI: 2.088

Cites: 4

Cited by: 1

Related to: 10