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Yi‐Shao Lai

Experimental studies of board-level reliability of chip-scale packages subjected to JEDEC drop test condition
2005 · Yi-Shao Lai, Ping-Feng Yang, et al. · Microelectronics Reliability · 182
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
2007 · Ping-Feng Yang, Yi-Shao Lai, et al. · Materials Science and Engineering A · 166
Thermomigration in SnPb composite flip chip solder joints
2006 · Annie T. Huang, A. M. Gusak, et al. · Applied Physics Letters · 162
Advanced Flip Chip Packaging
2013 · Ho-Ming Tong, Yi-Shao Lai, et al. · Springer eBooks · 143
Support excitation scheme for transient analysis of JEDEC board-level drop test
2005 · Chang-Lin Yeh, Yi-Shao Lai · Microelectronics Reliability · 89
A review of three-dimensional viscoelastic models with an application to viscoelasticity characterization using nanoindentation
2011 · Dao-Long Chen, Ping-Feng Yang, et al. · Microelectronics Reliability · 77
Alloying modification of Sn–Ag–Cu solders by manganese and titanium
2008 · Li-Wei Lin, Jenn-Ming Song, et al. · Microelectronics Reliability · 77
Electromigration of Sn–37Pb and Sn–3Ag–1.5Cu/Sn–3Ag–0.5Cu composite flip–chip solder bumps with Ti/Ni(V)/Cu under bump metallurgy
2006 · Yi-Shao Lai, Kuo-Ming Chen, et al. · Microelectronics Reliability · 75
Electromigration Reliability and Morphologies of Cu Pillar Flip-Chip Solder Joints with Cu Substrate Pad Metallization
2008 · Yi-Shao Lai, Ying-Ta Chiu, et al. · Journal of Electronic Materials · 72
Evaluation of board-level reliability of electronic packages under consecutive drops
2005 · Chang-Lin Yeh, Yi-Shao Lai, et al. · Microelectronics Reliability · 71
Characteristics of ZnO thin films prepared by radio frequency magnetron sputtering
2007 · Ping-Feng Yang, Hua-Chiang Wen, et al. · Microelectronics Reliability · 67
Nanomechanical responses of intermetallic phase at the solder joint interface – Crystal orientation and metallurgical effects
2011 · Jenn-Ming Song, Bo-Ron Huang, et al. · Materials Science and Engineering A · 61
Effect of entropy production on microstructure change in eutectic SnPb flip chip solder joints by thermomigration
2006 · Fan-Yi Ouyang, K. N. Tu, et al. · Applied Physics Letters · 61
Multiscale simulation of nanoindentation on Ni (100) thin film
2008 · Chung-Ting Wang, Sheng-Rui Jian, et al. · Applied Surface Science · 60
Atomic-level simulations of nanoindentation-induced phase transformation in mono-crystalline silicon
2007 · Yen-Hung Lin, Tei-Chen Chen, et al. · Applied Surface Science · 60
Local melting induced by electromigration in flip-chip solder joints
2006 · C. M. Tsai, Y. L. Lin, et al. · Journal of Electronic Materials · 60
Characteristics of current crowding in flip-chip solder bumps
2005 · Yi-Shao Lai, Chin-Li Kao · Microelectronics Reliability · 59
Evaluation of solder joint strengths under ball impact test
2007 · Yi-Shao Lai, Hsiao-Chuan Chang, et al. · Microelectronics Reliability · 58
Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding
2010 · Jiunn Chen, Yi-Shao Lai, et al. · Microelectronics Reliability · 56
Fine pitch copper wire bonding in high volume production
2010 · Bernd K. Appelt, Andy Tseng, et al. · Microelectronics Reliability · 56
Effect of current crowding on whisker growth at the anode in flip chip solder joints
2007 · Fan-Yi Ouyang, Kai Chen, et al. · Applied Physics Letters · 54
Cross-sectional transmission electron microscopy observations on the Berkovich indentation-induced deformation microstructures in GaN thin films
2007 · Chi-Hui Chien, Sheng-Rui Jian, et al. · Journal of Physics D Applied Physics · 54
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Electromigration induced high fraction of compound formation in SnAgCu flip chip solder joints with copper column
2008 · Luhua Xu, Jung-Kyu Han, et al. · Applied Physics Letters · 51
Molecular Dynamics Simulation of Nanoindentation-induced Mechanical Deformation and Phase Transformation in Monocrystalline Silicon
2008 · Yen-Hung Lin, Sheng-Rui Jian, et al. · Nanoscale Research Letters · 50
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Effect of the combination of electromigration and thermomigration on phase migration and partial melting in flip chip composite SnPb solder joints
2006 · Annie T. Huang, K. N. Tu, et al. · Journal of Applied Physics · 49
Works count: 294
Citation count: 5,043
H-index: 36
I10-index: 147
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