Work

Fine pitch copper wire bonding in high volume production

Year: 2010

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2010.06.006

Authors: Bernd K. Appelt, Andy Tseng, Chun-Hsiung Chen, Yi-Shao Lai

Institution: Advanced Semiconductor Engineering (Taiwan)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2000254080

FWCI: 5.636

Cites: 28

Cited by: 56

Related to: 10