Work

Investigation of growth behavior of Al–Cu intermetallic compounds in Cu wire bonding

Year: 2010

Type: article

Source: Microelectronics Reliability

DOI: 10.1016/j.microrel.2010.09.034

Authors: Jiunn Chen, Yi-Shao Lai, Yi-Wun Wang, C.R. Kao

Institutions: Advanced Semiconductor Engineering (Taiwan), National Taiwan University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W2000264894

FWCI: 1.715

Cites: 50

Cited by: 56

Related to: 10