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Xiu-Wei Liang
Institution:
National Pingtung University of Science and Technology
Observed institution:
National Pingtung University of Science and Technology
OpenAlex ID:
A5058771369
Response prediction and verification for PCB with package due to thermal and random vibration coupling effects
2009
·
Bor-Tsuen Wang
, Fu-Xiang Hsu
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
4
A refined finite element model verification for IC packaged PCB with thermal effects
2010
·
Bor-Tsuen Wang
, Xiu-Wei Liang
, et al.
·
International Microsystems, Packaging, Assembly and Circuits Technology Conference
·
1
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2
Citation count:
5
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