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Cadmus C. A. Yuan

Observed names: Cadmus A. Yuan, Cadmus C A Yuan, Cadmus C.A. Yuan, Cadmus Chang-Ann Yuan, Cadmus YUAN, Cadmus Yuan, Yuan Cadmus C.A., Yuan, Cadmus
Observed institutions: NXP (Netherlands), Netherlands Organisation for Applied Scientific Research, Chinese Academy of Sciences, National Tsing Hua University, Chung Shan Medical University Hospital, Institute of Semiconductors, Feng Chia University, Delft University of Technology
ORCID: 0000-0002-2699-9532
Observed ORCID: 0000-0002-2699-9532
OpenAlex ID: A5068931208
Nanowire-based gas sensors
2012 · Xianping Chen, Cell K.Y. Wong, et al. · Sensors and Actuators B Chemical · 397
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers
2011 · Xianping Chen, Cadmus Yuan, et al. · Journal of Molecular Modeling · 95
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Impact of the functional group on the working range of polyaniline as carbon dioxide sensors
2011 · Xianping Chen, Cell K.Y. Wong, et al. · Sensors and Actuators B Chemical · 65
Thermal and mechanical effects of voids within flip chip soldering in LED packages
2014 · Yang Liu, Stanley Y.Y. Leung, et al. · Microelectronics Reliability · 46
Product level accelerated lifetime test for indoor LED luminaires
2013 · Sau Koh, Cadmus Yuan, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 46
Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes
2013 · Huaiyu Ye, Sau Wee Koh, et al. · Applied Thermal Engineering · 45
Solder Joint Reliability Modeling by Sequential Artificial Neural Network for Glass Wafer Level Chip Scale Package
2020 · Cadmus C. A. Yuan, Chang-Chi Lee · IEEE Access · 40
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Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors
2012 · Xianping Chen, Cadmus A. Yuan, et al. · Sensors and Actuators B Chemical · 39
Deep machine learning of the spectral power distribution of the LED system with multiple degradation mechanisms
2020 · Cadmus C A Yuan, JiaJie Fan, et al. · Journal of Mechanics · 34
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Solder Joint Reliability Risk Estimation by AI-Assisted Simulation Framework with Genetic Algorithm to Optimize the Initial Parameters for AI Models
2021 · Cadmus Yuan, Xuejun Fan, et al. · Materials · 27
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Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering
2014 · Yang Liu, Jia Zhao, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 26
Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials
2012 · Xianping Chen, Li Shen, et al. · Sensors and Actuators B Chemical · 24
Biomechanical analysis of rigid and non-rigid connection with implant abutment designs for tooth-implant supported prosthesis: A finite element analysis
2021 · Yen-Chang Huang, Shinn-Jyh Ding, et al. · Journal of Dental Sciences · 23
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Molecular simulation on the material/interfacial strength of the low-dielectric materials
2007 · Cadmus A. Yuan, Olaf van der Sluis, et al. · Microelectronics Reliability · 20
Wafer-level packaging solder joint reliability lifecycle prediction using SVR-based machine learning algorithm
2023 · Hsuan-Chen Kuo, Chih-Yi Chang, et al. · Journal of Mechanics · 18
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Interfacial reaction and failure mode analysis of the solder joints for flip-chip LED on ENIG and Cu-OSP surface finishes
2015 · Yang Liu, Fenglian Sun, et al. · Microelectronics Reliability · 18
Design of vertical fin arrays with heat pipes used for high-power light-emitting diodes
2014 · Huaiyu Ye, Bo Li, et al. · Microelectronics Reliability · 18
Biomechanical evaluation of bridge span with three implant abutment designs and two connectors for tooth-implant supported prosthesis: A finite element analysis
2022 · Ling-Shiuan Huang, Yen-Chang Huang, et al. · Journal of Dental Sciences · 17
Kinematic Analysis of A 6-DOF Robotic Arm
2019 · Minh Tuan Nguyen, Cadmus Yuan, et al. · Mechanisms and machine science · 17
Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging
2014 · Yang Liu, Joost Meerwijk, et al. · Journal of Materials Science Materials in Electronics · 17
Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-Chip LED on ENIG Substrate
2015 · Yang Liu, Fenglian Sun, et al. · Journal of Electronic Materials · 16
Effect of temperature gradient on moisture diffusion in high power devices and the applications in LED packages
2013 · Xuejun Fan, Cadmus Yuan · IEEE Electronic Components and Technology Conference (ECTC) · 15
Molecular simulation strategy for mechanical modeling of amorphous/porous low-dielectric constant materials
2008 · Cadmus A. Yuan, Olaf van der Sluis, et al. · Applied Physics Letters · 15
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Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks
2023 · Cadmus Yuan, Qinghua Su, et al. · Materials · 14
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AI-assisted Design for Reliability: Review and Perspectives
2024 · Cadmus Yuan, S. D. M de Jong, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 13
Works count: 97
Citation count: 1,323
H-index: 17
I10-index: 31
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