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Author

Abdallah Alakayleh

ORCID: 0009-0006-5364-5218
Observed ORCID: 0009-0006-5364-5218
OpenAlex ID: A5070071113
Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions
2023 · Minghong Jian, Sa’d Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 36
Investigating the Evolution of Creep Properties During Thermal Cycling of Homogeneous Lead-Free Solder Joints
2023 · Mohamed El Amine Belhadi, Sa’d Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 24
Drop Shock Performance of SAC-Bi Compared to SnPb
2022 · Palash Pranav Vyas, Mohamed El Amine Belhadi, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 16
Effects of Multiple Reflows on IMC and Shear Strength of Individual Solder Joints
2023 · Sufyan Tahat, Abdallah Alakayleh, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 15
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging
2023 · Mohamed El Amine Belhadi, Sa'd Hamasha, et al. · Journal of Electronic Packaging · 12
Effect of Solder Paste Alloy and Volume on Solder Voiding
2023 · Abdallah Alakayleh, Mohamed El Amine Belhadi, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 12
The impact of paste alloy, paste volume, and surface finish on solder joint
2024 · Abdallah Alakayleh, Sa'd Hamasha, et al. · Microelectronics Reliability · 10
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish
2025 · Abdallah Alakayleh, Sa'd Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 5
Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content
2024 · Wa’ad Tarman, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 5
Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy
2024 · Saddam Daradkeh, Palash Pranav Vyas, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3
The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys
2024 · Sergio Bolanos, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2
Aging Effects on SAC305 Solder Joints: Correlating Intermetallic Compound Evolution, Hardness, and Drop-Shock Performance in ENIG and Immersion Tin Finishes
2026 · Saddam Daradkeh, Abdallah Alakayleh, et al. · Journal of Electronic Packaging · 1
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The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys
2024 · Saddam Daradkeh, Elizabeth Gainey, et al. · SMTA International · 1
Microhardness Analysis of Reflowed Solder Joints: Effect of Paste Alloy and Paste Volume
2024 · Abdallah Alakayleh, Sufyan Tahat, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 1
Impact of Antimony Concentration on the Fatigue Performance of Sn-Ag-Cu Solder Alloys
2025 · Sergio Bolanos, Yanal Masarweh, et al. · ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK)
Shear Strength Analysis of Aging SAC-Bi Solder Joints with Different Solder Paste Volumes
2024 · Shaheen Pouya, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
Works count: 16
Citation count: 143
H-index: 7
I10-index: 7
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