Work

Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content

Year: 2024

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm55375.2024.10709615

Authors: Wa’ad Tarman, Ali Alahmer, Sergio Bolanos, Shaheen Pouya, Abdallah Alakayleh, Mohamed El Amine Belhadi, Sa’d Hamasha

Institution: Auburn University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W4403390905

FWCI: 3.341

Cites: 38

Cited by: 5

Related to: 10