Author

Mohamed El Amine Belhadi

Observed name: Mohamed Belhadi

Institution: Auburn University

Observed institution: Auburn University

ORCID: 0000-0003-1694-2396

Observed ORCID: 0000-0003-1694-2396

OpenAlex ID: A5028101643

The Effect of Micro-Alloying and Surface Finishes on the Thermal Cycling Reliability of Doped SAC Solder Alloys

2022 · Francy John Akkara, Sa’d Hamasha, et al. · Materials · 49

PDF

Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions

2023 · Minghong Jian, Sa’d Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 36

The Impact of Bi Content on the Coarsening Kinetics of IMC Particles and Creep Deformation Under Thermal Cycling

2023 · Mohamed El Amine Belhadi, Sa’d Hamasha, et al. · Journal of Electronic Materials · 31

The Effect of Bi on the Mechanical Properties of Aged SAC Solder Joint

2020 · Mohamed El Amine Belhadi, Francy John Akkara, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 29

Effect of Bi content and aging on solder joint shear properties considering strain rate

2023 · Mohamed El Amine Belhadi, Sa'd Hamasha, et al. · Microelectronics Reliability · 27

Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis

2022 · Xin Wei, Mohamed El Amine Belhadi, et al. · Journal of Electronic Packaging · 26

Investigating the Evolution of Creep Properties During Thermal Cycling of Homogeneous Lead-Free Solder Joints

2023 · Mohamed El Amine Belhadi, Sa’d Hamasha, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 24

Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies

2024 · Palash Pranav Vyas, Ali Alahmer, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 18

Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions

2023 · Minghong Jian, Sa’d Hamasha, et al. · Materials · 17

PDF

Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint

2021 · Mohamed El Amine Belhadi, Francy John Akkara, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 17

Drop Shock Performance of SAC-Bi Compared to SnPb

2022 · Palash Pranav Vyas, Mohamed El Amine Belhadi, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 16

Effects of Multiple Reflows on IMC and Shear Strength of Individual Solder Joints

2023 · Sufyan Tahat, Abdallah Alakayleh, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 15

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

2022 · Xin Wei, Sa'd Hamasha, et al. · Journal of Electronic Packaging · 14

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging

2023 · Mohamed El Amine Belhadi, Sa'd Hamasha, et al. · Journal of Electronic Packaging · 12

Effect of Solder Paste Alloy and Volume on Solder Voiding

2023 · Abdallah Alakayleh, Mohamed El Amine Belhadi, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 12

Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature

2023 · Xin Wei, Sa'd Hamasha, et al. · Microelectronics Reliability · 11

Fatigue Performance of Ball Grid Array Components at Elevated Temperature

2021 · Xin Wei, Minghong Jian, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 8

Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling

2021 · Minghong Jian, Palash Pranav Vyas, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 8

Employing spatial and amplitude discriminators to partition and analyze LPBF surface features

2022 · Rong Zhao, Andrii Shmatok, et al. · Precision Engineering · 7

PDF

Indentation Creep Properties Evolution of Lead-Free Solder Joints Subjected to Thermal Cycling

2022 · Mohamed El Amine Belhadi, Xin Wei, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 6

Evaluating Shear Properties of Individual Solder Joints in Ball Grid Arrays: The Impact of Silver (Ag) and Bismuth (Bi) Content

2024 · Wa’ad Tarman, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 5

Aging Effect on Drop-Shock Reliability of SnAgCu305 Solder Alloy

2024 · Saddam Daradkeh, Palash Pranav Vyas, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3

Fatigue and Shear Properties of Novel Lead-free Solder Joints with Low Melting Temperatures

2022 · Xin Wei, Mohamed El Amine Belhadi, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 3

The Effect of Bi Content and Strain Rate on Tensile Properties of SnAgCu-Bi Alloys

2024 · Sergio Bolanos, Ali Alahmer, et al. · I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems · 2

The Effect of Board Design on the Drop Shock Performance of Lead-Free Solder Alloys

2024 · Saddam Daradkeh, Elizabeth Gainey, et al. · SMTA International · 1

Works count: 32

Citation count: 401

H-index: 13

I10-index: 16