Work

Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling

Year: 2021

Type: conference-paper

Source: I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems

DOI: 10.1109/itherm51669.2021.9503294

Authors: Minghong Jian, Palash Pranav Vyas, Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Jeff Suhling, Pradeep Lall

Institution: Auburn University

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

Open Access status: closed

OpenAlex ID: W3191244589

FWCI: 3.095

Cites: 41

Cited by: 8

Related to: 10