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Minghong Jian
Institution:
Nvidia (United States)
Observed institutions:
Nvidia (United States),
Auburn University
OpenAlex ID:
A5080922772
Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions
2023
·
Minghong Jian
, Sa’d Hamasha
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
36
Fatigue Properties of Lead-free Doped Solder Joints
2018
·
Sinan Su
, Francy John Akkara
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
29
Effects of Surface Finish on the Shear Fatigue of SAC-Based Solder Alloys
2019
·
Sinan Su
, Minghong Jian
, et al.
·
IEEE Transactions on Components Packaging and Manufacturing Technology
·
22
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint
2020
·
Minghong Jian
, Sinan Su
, et al.
·
Journal of Electronic Packaging
·
20
Analysis and Modeling of Aged SAC-Bi Solder Joints Subjected to Varying Stress Cycling Conditions
2023
·
Minghong Jian
, Sa’d Hamasha
, et al.
·
Materials
·
17
PDF
Effect of Surface Finish on the Fatigue Behavior of Bi-based Solder Joints
2019
·
Sinan Su
, Minghong Jian
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
12
Fatigue Performance of Ball Grid Array Components at Elevated Temperature
2021
·
Xin Wei
, Minghong Jian
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
8
Fatigue Performance of Aged SAC-Bi Solder Joint under Varying Stress Cycling
2021
·
Minghong Jian
, Palash Pranav Vyas
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
8
Effect of Varying Amplitude Cycling on SAC-Bi Solder Joint Fatigue
2020
·
Minghong Jian
, Xin Wei
, et al.
·
I-THERM :/I-THERM - Intersociety Conference on Thermal Phenomena in Electronic Systems
·
4
New Methodology Assessment of Copper Trace and Solder Joint Fatigue Failures in Board-level Random Vibrations for Automotive Applications
2023
·
Valeriy Khaldarov
, Andy Zhang
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
2
Fatigue and Shear Properties of High Reliable Solder Joints for Harsh Applications
2018
·
Sinan Su
, Minghong Jian
, et al.
·
SMTA International
·
2
Pad Cratering and Pin Pull Strength for Large BGA and Connectors — How Are They Correlated?
2024
·
Dongji Xie
, Joe Hai
, et al.
·
IEEE Electronic Components and Technology Conference (ECTC)
·
1
Effect of New SAC-Bi Solder Pastes on Thermal Cycling Reliability Considering Aging
2020
·
Mohamed El Amine Belhadi
, Francy Akkara
, et al.
·
SMTA International
·
1
Fatigue Properties and Reliability of SnAgCu-Bi Solder Joints in Varying Stress Amplitudes
2021
·
Minghong Jian
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Works count:
14
Citation count:
162
H-index:
8
I10-index:
6
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