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Pad Cratering and Pin Pull Strength for Large BGA and Connectors — How Are They Correlated?

Year: 2024

Type: conference-paper

Source: IEEE Electronic Components and Technology Conference (ECTC)

DOI: 10.1109/ectc51529.2024.00238

Authors: Dongji Xie, Joe Hai, Vivienne Zou, Zhongming Wu, Minghong Jian

Institution: Nvidia (United States)

Language: English

Topic: Electronic Packaging and Soldering Technologies

Subfield: Electrical and Electronic Engineering

Field: Engineering

Domain: Physical Sciences

SDG: Industry, innovation and infrastructure

Open Access status: closed

OpenAlex ID: W4400034612

FWCI: 0.668

Cites: 4

Cited by: 1

Related to: 10