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G.Q. Zhang

Observed names: G Q Zhang, G. Q Zhang, G. Q. (Kouchi) Zhang, G. Q. Zhang, G. Q. Zhang CadmusYuan, G. Q. Zhang,, G. Zhang, G.O. Zhang, G.Q Zhang, G.Q. (Kouchi) Zhang, G.Q. Kouchi Zhang, G.Q., Kouchi, ZHANG, G.Y. Zhang, GQ Zhang, Zhang GQ, Zhang, G Q, Zhang, G. (author), Zhang, G. Q, Zhang, G.Q., Zhang, GQ Kouchi
Observed institutions: NXP (Netherlands), Isfahan University of Technology, Lamar University, Chinese Academy of Sciences, Peking University, University of Tehran, Fudan University, Guilin University of Technology, Materials innovation institute, Changzhou Institute of Technology, Philips (Netherlands), NXP (Germany), Institute of Semiconductors, Signify (Netherlands), Guilin University of Electronic Technology, Eindhoven University of Technology, Delft University of Technology
ORCID: 0000-0002-8023-5170
Observed ORCIDs: 0000-0002-8023-5170, 0009-0002-6920-8443
OpenAlex ID: A5072654050
Mechanics of Microelectronics
2006 · Zhang, G. Q, Fan, X. J, et al. · Solid mechanics and its applications · 214
P-type β-Ga2O3 metal-semiconductor-metal solar-blind photodetectors with extremely high responsivity and gain-bandwidth product
2020 · Z.X. Jiang, Z.Y. Wu, et al. · Materials Today Physics · 138
Interfacial Delamination Mechanisms During Soldering Reflow With Moisture Preconditioning
2008 · Xuejun Fan, G.Q. Zhang, et al. · IEEE Transactions on Components and Packaging Technologies · 112
Degradation of optical materials in solid-state lighting systems
2019 · M. Yazdan Mehr, A. Bahrami, et al. · International Materials Reviews · 104
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Photodegradation of bisphenol A polycarbonate under blue light radiation and its effect on optical properties
2012 · M. Yazdan Mehr, W.D. van Driel, et al. · Optical Materials · 87
Experimental Verification and Optimization Analysis of Warpage for Panel-Level Fan-Out Package
2017 · Fengze Hou, Tingyu Lin, et al. · IEEE Transactions on Components Packaging and Manufacturing Technology · 86
Degradation modeling of mid-power white-light LEDs by using Wiener process
2015 · Jianlin Huang, Dušan S Golubović, et al. · Optics Express · 84
A Micromechanics-Based Vapor Pressure Model in Electronic Packages
2004 · X. J. Fan, J. Zhou, et al. · Journal of Electronic Packaging · 70
An accelerated test method of luminous flux depreciation for LED luminaires and lamps
2015 · C. Qian, X.J. Fan, et al. · Reliability Engineering & System Safety · 66
Degradation Mechanisms of Mid-Power White-Light LEDs Under High-Temperature–Humidity Conditions
2015 · Jianlin Huang, Dusan S Golubovic, et al. · IEEE Transactions on Device and Materials Reliability · 66
Rapid Degradation of Mid-Power White-Light LEDs in Saturated Moisture Conditions
2015 · Jianlin Huang, Dusan S. Golubovic, et al. · IEEE Transactions on Device and Materials Reliability · 59
Lumen degradation modeling of white-light LEDs in step stress accelerated degradation test
2016 · Jianlin Huang, Dušan S Golubović, et al. · Reliability Engineering & System Safety · 58
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Prediction and verification of process induced warpage of electronic packages
2003 · W.D. van Driel, G.Q. Zhang, et al. · Microelectronics Reliability · 58
Driving Mechanisms of Delamination Related Reliability Problems in Exposed Pad Packages
2008 · W.D. van Driel, M.A.J. van Gils, et al. · IEEE Transactions on Components and Packaging Technologies · 55
Packaging Induced Die Stresses—Effect of Chip Anisotropy and Time-Dependent Behavior of a Molding Compound
2003 · W. D. van Driel, J. H. J. Janssen, et al. · Journal of Electronic Packaging · 52
Response Surface Modeling for Nonlinear Packaging Stresses
2003 · W. D. van Driel, G. Q. Zhang, et al. · Journal of Electronic Packaging · 50
Color Shift Investigations for LED Secondary Optical Designs: Comparison between BPA-PC and PMMA
2015 · Guangjun Lu, M. Yazdan Mehr, et al. · Optical Materials · 49
An overview of scanning acoustic microscope, a reliable method for non-destructive failure analysis of microelectronic components
2015 · M. Yazdan Mehr, A. Bahrami, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 47
Accelerated life time testing and optical degradation of remote phosphor plates
2014 · M. Yazdan Mehr, W.D. van Driel, et al. · Microelectronics Reliability · 46
Product level accelerated lifetime test for indoor LED luminaires
2013 · Sau Koh, Cadmus Yuan, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 46
Numerical modeling of warpage induced in QFN array molding process
2007 · D.G. Yang, K.M.B. Jansen, et al. · Microelectronics Reliability · 45
Analysis of Cu/low-k bond pad delamination by using a novel failure index
2006 · M.A.J. van Gils, O. van der Sluis, et al. · Microelectronics Reliability · 45
The Rationale and Paradigm of "More than Moore"
2006 · G.Q. Kouchi Zhang, M. Graef, et al. · IEEE Electronic Components and Technology Conference (ECTC) · 45
Prediction of Delamination Related IC & Packaging Reliability Problems
2005 · W.D. van Driel, M.A.J. van Gils, et al. · Microelectronics Reliability · 45
Modeling of cure-induced warpage of plastic IC packages
2004 · D.G. Yang, K.M.B. Jansen, et al. · International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) · 45
Works count: 437
Citation count: 5,318
H-index: 38
I10-index: 159
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